Patents Assigned to The Intec Group, Inc.
  • Patent number: 5274531
    Abstract: A lead frame for mounting a circuit component includes plural terminal legs for connection with a circuit. At least two of the terminal legs have pads for connection with the circuit component which has wire leads. The lead frame pads and wire leads are of materials which are incompatible for welding. A rivet of a material compatible for welding with the component lead wires is mounted in the pad of each terminal leg for connection with the circuit element. A weld secures each component lead wire with one of the rivets.
    Type: Grant
    Filed: June 17, 1991
    Date of Patent: December 28, 1993
    Assignee: The Intec Group, Inc.
    Inventor: Stanley M. Perlman