Abstract: Individual ceramic substrates for electronic microcircuits are formed in an array having rectangular perforations which define score lines along which the array is broken to yield the individual substrates. The surfaces of the rectangular perforations are metallized and leads are attached thereto by thermocompression bonding after the array is broken. The rectangular perforations result in semi-rectangular openings around the periphery of the individual substrates, which eliminate tensile forces on the substrate during lead bonding.

Abstract: A lead frame is provided which allows for the lengthening of leads caused by the bonding of the lead tips to a ceramic substrate, without causing the lead frame to deform in a vertical direction. The lead frame comprises a generally flat but relatively rigid outer frame portion. Lead support members integral with the outer frame portion support a plurality of integrally formed leads. The leads are attached at one end to a lead support member. The other end of each lead is free for bonding to the conductor pads of a substrate. The lead support members are constructed to yield and deform in the horizontal plane of the lead frame in a direction outward along the longitudinal axis of the leads to accommodate the flow of metal and thermal expansion of the leads due to bonding. Several embodiments are disclosed showing different possibilities for constructing the lead support members to yield in the plane of the frame.

Abstract: In an apparatus for the assembly of microcomponents semiconductor devices, an improvement is provided for the step involving wire bonding of thin gold wires between conductor pads on the semiconductor chip and the external leads. In this type of apparatus generally, the wire bonding step involves the bonding of thin gold conductor wires between the conductor pads and the external leads. In the type apparatus wherein the present invention is provided, a lower anvil articular upward to a position underneath and supporting the semiconductor chip during the bonding process and then articulates downward away from the chip after bonding. The wires are placed and bonded by a capillary tube which articulates between positions above the bonding pads of the chip and the leads. The improvement comprises a wall disposed from the lower anvil and surrounding the chip between the conducting pads and the leads, whereby the wires are supported by the wall as they are withdrawn from the capillary tube.

Abstract: An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors. Bonding is conducted by clamping the leads to the conductors at the bond site, moving a heated anvil into contact with a heat conductive path to the bond site and withdrawing the heated anvil while maintaining the clamping.

Abstract: A weight scale includes a capacitive force load cell for linearly transducing force into electrical capacity. A C-shaped spring supports two capacitor plates adjacent the distal ends of the arms with the surfaces of the plates being normally parallel. Weight is transmitted from the platform of the scale to a pin which acts to separate the arms against the spring force. The plates are shaped, preferably triangularly, so that the change in capacitance as they separate is linear. The load cell is connected in circuit with an oscillator so that the change in capacitance is directly proportional to change in frequency as a measure of the weight of the load on the scale's platform.

Abstract: An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors.

Abstract: An electrode assembly for simultaneously welding all the leads of a semiconductor chip to an outer lead frame is disclosed. The electrode assembly includes a gross electrode opposed to a plurality of spot electrodes, and a plurality of parallelogram support members for the spot electrodes, and a housing. Each of the plurality of parallelogram support members includes a first leg fixedly attached to the housing and a second leg supporting one of the spot electrodes. Each of the second legs is resiliently deformable into a stressed position when the electrode supported thereby is biased against the work piece whereby each spot electrode is independently responsive to structural changes in the work piece and contact is maintained between the work piece and the spot electrodes during the entire welding operation.

Abstract: A hitch feed assembly for automatically aligning individual lead frames at a bonding site in both the longitudinal and lateral directions is disclosed. The alignment is attained as a result of the cooperation between a plurality of chamfered pawls and the sprocket holes in the film-carrier. The pawls are chamfered along three sides in order to attain alignment in both the longitudinal and lateral directions. Significantly, the pawls come into operational contact with the sprocket holes while the lead frame film-carrier is under minimal tension so that the pressure exerted on the edges of the sprocket holes by the pawls will be minimal, thereby avoiding any deformation in the shape of the sprocket holes.

Abstract: Apparatus for accurately bonding leads to a semi-conductor die or the like includes a hitch feed and guide assembly for sequentially positioning each set of leads on a film carrier format over the die to be bonded to the leads. A micromanipulator adjusts the leads relative to the die prior to bonding. Displacement means provide unambiguous rectilinear separate movement of the bonding tool laterally into alignment with the lead and semi-conductor and then into contact with the leads to apply bonding heat and pressure.

Abstract: Bonding apparatus bonds inner leads on a film carrier to outer leads. Outer lead frame stock and the film carrier bearing the inner leads and dies are fed to the bonding site. A set of inner leads and the die thereto bonded is punched from the film carrier and moved to the bonding position in a manner such that the inner leads are aligned with the outer leads. A bonding tool effects the bond. Thereafter, the next set of outer leads and inner leads and die are advanced to the bonding site.