Abstract: A method and system for probing with electrical test signals on an integrated circuit specimen using a high resolution microscope positioned for observing a surface of the specimen exposing electrically conductive terminals thereon. A housing is provided with a carrier therein for supporting the specimen in relation to the microscope and a probe assembly is positionable on the surface of the specimen for conveying and acquiring electrical test signals to and from the specimen. A drive system is provided for shifting at least one of the probe and the carrier to a predetermined test position. In one form the system has a heat shield for protecting one of the probe assembly and the carrier from heat energy generated upon operation of the drive system, and in another form, the system has an environmental control for maintaining a desired temperature within the housing so that accurate measurements may be taken from the specimen.

Abstract: A probe assembly for use at a test station for contacting a target on an electrical circuitry component. The probe assembly includes an elongate tubular housing with a base of insulative material rigidly supported in the housing adjacent one end thereof. An interior beam assembly connects a contact block to the base with this beam assembly including a relatively flexible cantilever beam. A relatively rigid second beam assembly extends from the contact block beyond the other end of the housing and holds a probe point for contacting the target. The probe assembly also includes an upper contact held by the housing and extending into the housing cavity toward the contact block, and a lower contact held by the housing and extending into the cavity toward the contact block. The spacing between the upper and lower contacts is greater than the height of the contact block and the surfaces of the contact block facing the contacts are conductive.

Abstract: Apparatus for testing electronic components, such as integrated circuit chips, at a depressed temperature. The apparatus includes mounting structure for holding the electronic component to be tested and a heating and cooling stage positioned in heat transfer relationship with the component. Disposed on the mounting structure is an open top reservoir surrounding the electronic component and extending thereabove for holding sufficient liquid fluorocarbon to cover the component. The apparatus also includes probe means comprising porbes for making contact at predetermined locations on the top surface of the component.

Abstract: A wire bonder apparatus for use in connecting a conductor wire to a conductive element on a work piece, such as a microelectronic chip or wafer. The bonder apparatus includes a work piece support station adapted to support a work piece observable through a microscope viewing arrangement, and a bonding head having a support arm on which is mounted a bonding tool and selectively movable wire clamping arms adapted to incrementally feed a bonding wire to the bonding tool. The support arm is caused to undergo a ramped movement so as to effect a predetermined progressively increasing contact force between the bonding tool and the work piece. In one embodiment, the clamping arms are adapted for cooperation with actuator means so as to effect incremental stepped arcuate movement of clamping fingers along the path traversed by the conductor wire whereby to lineraly advance the bonding wire when gripped by the clamping fingers.