Patents Assigned to The Nexsys Corporation
  • Patent number: 7758741
    Abstract: There is here disclosed a nozzle type ELID grinding apparatus comprising a conductive grindstone 12 having a contact surface with a workpiece 1; and an ion supply nozzle 16 that supplies an electrolytic medium 2 containing hydroxyl ions (OH?) onto a surface of the conductive grindstone, the workpiece being ground while the surface of the grindstone is dressed by electrolysis or chemical reaction. Furthermore, the apparatus comprises a grindstone power source 14 for setting the conductive grindstone to be a positive potential (+).
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: July 20, 2010
    Assignees: Riken, The NEXSYS Corporation
    Inventors: Hitoshi Omori, Yoshihiro Uehara, Kazutoshi Katahira, Muneaki Asami, Norihide Mitsuishi, Souichi Ishikawa
  • Patent number: 7448120
    Abstract: There are provided a base frame 12 positioned below a horizontal axis O; a pair of clamp units 14 positioned at the two ends above the base frame; a pair of support units 16 that horizontally support the long workpiece in two locations, and that are capable of moving vertically; and machining units 18 that are capable of machining the long workpiece. The two clamp units 14 are capable of moving from the outside toward the inside, which support the long workpiece in two locations, and rotate around the horizontal axis O in synchronization with each other.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: November 11, 2008
    Assignees: Riken, The NEXSYS Corporation, Ikegami Precision Tooling Co., Ltd.
    Inventors: Hitoshi Ohmori, Norihide Mitsuishi, Takahiro Miura, Naoshi Iwamitsu
  • Publication number: 20080067704
    Abstract: The micro-molding equipment contains a preform molding equipment 10 taking a single-cavity of a preform material 3 corresponding to a small precision optical component to be molded with a runnerless mold, and a precision compression molding equipment 40 for after molding the preform material 3 by primary compression molding in a vacuum state, cooling the preform material to a temperature near a glass transition point, and then re-softening a surface layer of the preform material and molding the same by secondary compression molding to transfer the small precision optical component thereto.
    Type: Application
    Filed: October 18, 2005
    Publication date: March 20, 2008
    Applicants: RIKEN, THE NEXSYS CORPORATION, SAN SEIMITSU KAKO LAB., LTD., IKEGAMI MOLD ENGINEERING CO., LTD., ASTOM R&D
    Inventors: Hitoshi Ohmori, Yoshihiro Uehara, Weimin Lin, Hatsuichi Takeyasu, Masao Washio, Keizo Ikegami, Takeya Shoji, Tomoaki Ando, Yukihiro Shirataki
  • Publication number: 20070199187
    Abstract: There are provided a base frame 12 positioned below a horizontal axis O; a pair of clamp units 14 positioned at the two ends above the base frame; a pair of support units 16 that horizontally support the long workpiece in two locations, and that are capable of moving vertically; and machining units 18 that are capable of machining the long workpiece. The two clamp units 14 are capable of moving from the outside toward the inside, which support the long workpiece in two locations, and rotate around the horizontal axis O in synchronization with each other.
    Type: Application
    Filed: February 28, 2007
    Publication date: August 30, 2007
    Applicants: RIKEN, THE NEXSYS CORPORATION, IKEGAMI PRECISION TOOLING CO., LTD.
    Inventors: Hitoshi Ohmori, Norihide Mitsuishi, Takahiro Miura, Naoshi Iwamitsu
  • Publication number: 20060124473
    Abstract: There is here disclosed a nozzle type ELID grinding apparatus comprising a conductive grindstone 12 having a contact surface with a workpiece 1; and an ion supply nozzle 16 that supplies an electrolytic medium 2 containing hydroxyl ions (OH?) onto a surface of the conductive grindstone, the workpiece being ground while the surface of the grindstone is dressed by electrolysis or chemical reaction. Furthermore, the apparatus comprises a grindstone power source 14 for setting the conductive grindstone to be a positive potential (+).
    Type: Application
    Filed: December 9, 2005
    Publication date: June 15, 2006
    Applicants: Riken, The Nexsys Corporation
    Inventors: Hitoshi Omori, Yoshihiro Uehara, Kazutoshi Katahira, Muneaki Asami, Norihide Mitsuishi, Souichi Ishikawa
  • Patent number: 6634072
    Abstract: There is a workpiece clamp device 10 for horizontally holding a thin section long workpiece 1 having a constant section shape or having the same section shape in spaced positions in a longitudinal direction in two positions of the same section shape. The workpiece clamp device 10 is constituted of a driving clamp device 10A and a driven clamp device 10B comprising the same holding device 12. The driving clamp device 10A rotates the workpiece 1 centering on a horizontal axis O extending in a longitudinal direction of the workpiece, and the driven clamp device 10B follows movement of the workpiece and idles centering on the horizontal axis. An arbitrary portion to be machined of the workpiece can be directed in a direction in which the portion is easily machined by the rotation (e.g., upward direction).
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: October 21, 2003
    Assignees: Riken, The Nexsys Corporation, Ikegami Precision Tooling Co., Ltd.
    Inventors: Hitoshi Ohmori, Kenichi Yoshikawa, Takahiro Miura, Naoshi Iwamitsu
  • Patent number: 6478661
    Abstract: A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cutting grindstone are trued by a plasma discharge. Then without applying the voltage, the cutting grindstone 2 is trued mechanically by the truing grindstone 6, and while the outer periphery and lower surface of the cutting grindstone are dressed electrolytically, the outer periphery and lower surface are made to contact a workpiece 1 and process a micro-V groove. This method makes it possible to produce an immersion grating with a high resolution using hard, brittle materials such as germanium, gallium arsenide and lithium niobate.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: November 12, 2002
    Assignees: Riken, The Nexsys Corporation
    Inventors: Hitoshi Ohmori, Noboru Ebizuka, Yutaka Yamagata, Shinya Morita, Sei Moriyasu, Muneaki Asami
  • Patent number: 6341999
    Abstract: A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: January 29, 2002
    Assignees: Riken, Utksystem Corporation, The Nexsys Corporation
    Inventors: Hitoshi Ohmori, Muneaki Asami, Akihiko Uzawa, Sadamasa Shigitani