Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

Abstract: A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate.

Abstract: A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.

Abstract: A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

Abstract: A computer system includes a bus system; a pluggable central processing unit circuit board, coupled to the bus system; a pluggable logic board coupled to the pluggable central processing unit circuit board through the bus system; a pluggable input/output board coupled to the pluggable logic board through the bus system; a first connector unit for directly connecting the pluggable central processing unit circuit board to a first predetermined location on the pluggable logic board; and a second connector unit for directly connecting the pluggable logic board to a predetermined location on the pluggable input/output board.

Abstract: Disclosed is a decorative panel for attachment to the exterior of a computer enclosure including a fastener receiving portion for facilitating attachment of the decorative panel to an outer surface of the computer enclosure, a plurality of irregular geometric shaped surface depressions on a first surface of the decorative panel fixed in an ornamental arrangement, and at least one bore which extends completely through the decorative panel adapted to allow air to flow through the decorative panel and into an interior of the computer enclosure.

Abstract: A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads extends from at least one of the side surfaces of the insulative package. Each of the leads has a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board such that, when the distal ends of the leads are secured to the printed circuit board, at least a portion of the insulative package is located below an upper surface of the printed circuit board.

Abstract: A computer system includes a first passive backplane having a local bus, a memory bus, and peripheral bus. The computer system includes a first printed circuit board having a microprocessor, and connected to the local bus and to the memory bus. The computer system includes a second printed circuit board having a memory and connected to the memory bus. The computer system also includes a third printed circuit board having a peripheral controller, and connected to the local bus and to the peripheral bus The disclosed computer system further includes a second backplane. The second backplane is connected to the first passive backplane through a connector, where at least one of the local and peripheral buses extends from the first passive backplane to the second backplane through the connector. The computer system also includes a plurality of peripheral slots located on the second backplane and connected to the peripheral bus.

Abstract: A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads.

Abstract: A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads.

Abstract: A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

Abstract: An electrically conductive contact beam for use in an electrical interconnect component. The contact beam includes a stabilizing section for securing the contact beam within a support substrate, and a contact section, connected to the stabilizing section, for establishing contact between the contact beam and an electrically conductive contact from another electrical interconnect component. The contact section includes a merge radius section connecting the contact section to the stabilizing section, a flexible section connected to the merge radius section and having an elongated curvature, a contact area, disposed at an end of the curvature opposite the merge radius section, for contacting the conductive contact from the other electrical interconnect component, and a lead-in section, connected to the contact area, for initiating deflection of the contact section upon contact of the lead-in section with a portion of the other electrical interconnect component.

Abstract: A computer system includes an exterior casing having an opening therein to permit user access to peripheral devices, such as floppy drives, CD ROM drives, tape drives, or optical drives. A door driven by a reversible motor slides along the exterior casing to open and close the opening in the exterior casing. A user may activate a sensor provided on the exterior casing to selectively open or close the door. The sensor may be a light-sensitive sensor, a voice-activated sensor, or a proximity sensor. Alternatively or in addition, the user may open and close the door via a system processor, for example, by entering commands via a keyboard. The door may slide along tracks within the exterior casing. In addition, the door may be locked in a closed position and unlocked to allow opening.

Abstract: A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts.

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract: A computer system includes a computer cabinet, a plurality of printed circuit boards housed within the computer cabinet, a processor secured to at least one of the printed circuit boards, a power supply cabinet remote from the computer cabinet, a power supply housed within the power supply cabinet and a signal interconnect unit, coupled to the computer cabinet and the power supply cabinet, for providing an electrical path between the computer cabinet and the power supply cabinet. The printed circuit boards and the slots into which they are inserted have corresponding color code labels. The purpose of this is to clearly identify the location of the slot which corresponds to the printed circuit board of the same color.