Patents Assigned to The Peregrine Falcon Corporation
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Patent number: 11833606Abstract: A solid-state bonding method sandwiches an intermediate layer between a pair of refractory metal members, e.g., of niobium, tantalum, and alloys, to form a composite bonding assembly. This sandwiching can be repeated with multiple refractory metal members. The intermediate layer is substantially uniform of at most 75 ?m thickness and composed of a material that is soluble and diffusive in the refractory metal members, e.g., of iron, nickel, cobalt, chromium, silicon, or carbon. Compressive pressure is applied, and the assembly is heated to a specified elevated temperature of at least 1280° C. The applied pressure and elevated temperature are maintained until the intermediate layer has dissolved surface oxides and asperities in the refractory metal members and has completely diffused into the refractory metal to create a seamless refractory metal bond. The pressures and temperatures needed are much lower than those required in direct diffusion bonding of refractory metals.Type: GrantFiled: March 28, 2023Date of Patent: December 5, 2023Assignee: Peregrine Falcon CorporationInventor: Robert E. Hardesty
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Patent number: 11654504Abstract: A solid-state bonding method sandwiches an intermediate layer between a pair of refractory metal members to form a composite bonding assembly. This sandwiching can be repeated with multiple refractory metal members. The intermediate layer is substantially uniform of at most 75 ?m thickness and composed of a material that is soluble and diffusive in the refractory metal members, such as any of carbon, silicon, chromium, iron, cobalt, and nickel. Compressive pressure is applied, and the assembly is heated to a specified elevated temperature of at least 1280° C. The applied pressure and elevated temperature are maintained until the intermediate layer has dissolved surface oxides and asperities in the refractory metal members and has completely diffused into the refractory metal to create a seamless refractory metal bond. The pressures and temperatures needed are much lower than those required in direct diffusion bonding of refractory metals.Type: GrantFiled: September 10, 2021Date of Patent: May 23, 2023Assignee: Peregrine Falcon CorporationInventor: Robert E. Hardesty
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Patent number: 9064852Abstract: A thermally conductive composite material, a thermal transfer device made of the material, and a method for making the material are disclosed. Apertures or depressions are formed in aluminum or aluminum alloy. Plugs are formed of thermal pyrolytic graphite. An amount of silicon sufficient for liquid interface diffusion bonding is applied, for example by vapor deposition or use of aluminum silicon alloy foil. The plugs are inserted in the apertures or depressions. Bonding energy is applied, for example by applying pressure and heat using a hot isostatic press. The thermal pyrolytic graphite, aluminum or aluminum alloy and silicon form a eutectic alloy. As a result, the plugs are bonded into the apertures or depressions. The composite material can be machined to produce finished devices such as the thermal transfer device. Thermally conductive planes of the thermal pyrolytic graphite plugs may be aligned in parallel to present a thermal conduction path.Type: GrantFiled: December 5, 2011Date of Patent: June 23, 2015Assignee: The Peregrine Falcon CorporationInventor: Robert E. Hardesty
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Patent number: 8919426Abstract: A heat pipe device and a corresponding method in which micro-channel embedded pulsating heat pipes are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will become slugs of liquid. Heating of the contents of the micro-channel at an evaporator region (heat source) will cause vaporization within the micro-channel and cooling at a heat sink will cause condensation within the micro-channel, acting to both drive fluid flow within the micro-channel and efficiently transfer heat. Such devices could be used in a number of different configurations, including one as a stacked set of micro-channel embedded substrates.Type: GrantFiled: October 22, 2007Date of Patent: December 30, 2014Assignee: The Peregrine Falcon CorporationInventor: Robert E. Hardesty
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Publication number: 20090101308Abstract: A heat pump device and method in which micro-channel embedded pulsating heat pumps are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will become slugs of liquid. Heating of the contents of the micro-channel at an evaporation (heat source) will cause vaporization within the micro-channel and cooling at a heat sink will cause condensation within the micro-channel, acting to both drive fluid flow within the micro-channel and efficiently transfer heat. Such devices could be used in a number of different configuration, including as a stacked set of micro-channel embedded substrates.Type: ApplicationFiled: October 22, 2007Publication date: April 23, 2009Applicant: THE PEREGRINE FALCON CORPORATIONInventor: Robert E. Hardesty
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Patent number: 6779713Abstract: A method for joining metal parts in which an aluminum rich surface is produced on a first metal part by selective removal of the beryllium component of a beryllium-aluminum alloy, as by said etching. The aluminum rich surface may then be joined to another aluminum rich surface by a brazing.Type: GrantFiled: April 8, 2003Date of Patent: August 24, 2004Assignee: The Peregrine Falcon CorporationInventors: John L. Emmons, Robert E. Hardesty
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Patent number: 6543678Abstract: A method for brazing beryllium-aluminum alloy members to form a beryllium-aluminum alloy assembly and coating the beryllium-aluminum alloy assembly in which an aluminum-silicon based braze alloy is placed between the beryllium-aluminum members at the locations for forming braze joints. The aluminum-silicon based braze alloy is surrounded by a brazing flux comprising aluminum fluoride. The beryllium-aluminum alloy members and the aluminum-silicon based braze alloy are heated to form the beryllium-aluminum alloy assembly. Oxidized surfaces appearing on the beryllium-aluminum alloy members are removed. Thereupon, the beryllium-aluminum alloy assembly is coated by plasma deposition of alumina-titania powder.Type: GrantFiled: September 29, 1997Date of Patent: April 8, 2003Assignee: The Peregrine Falcon CorporationInventors: John L. Emmons, Robert Hardesty