Abstract: Circuits characterized by plural conductive paths supported on a non-conductive substrate are provided. Ceramic filler compositions and methods for preparing the ceramic filler compositions are also provided. Further, fluoropolymer-ceramic filler compositions and their laminates along with their respective methods for their preparation are provided. The fluoropolymer-ceramic filler compositions provide for excellent properties for dielectric constant, loss tangent and temperature coefficient of dielectric constant. In addition, electrical substrate materials having a conductive outer layer supported on a thin sheet of insulating material are also provided.
Type:
Grant
Filed:
December 12, 2013
Date of Patent:
September 27, 2016
Assignees:
Centre for Materials for Electronics Technology (C-MET), The Secretary, Dept. of Electronics and IT, Govt. of India
Abstract: The present disclosure is in the field of electrical circuits and particularly to circuits characterized by plural conductive paths supported on a non-conductive substrate. The disclosure relates to ceramic filler compositions and methods for preparing said compositions. Further, the present disclosure discloses fluoropolymer-ceramic filler compositions and their laminates along with their respective methods for preparing the same. Said fluoropolymer-ceramic filler compositions provide for excellent properties for dielectric constant, loss tangent and temperature coefficient of dielectric constant. In addition, electrical substrate materials comprising of a conductive outer layer supported on a thin sheet of insulating material is also disclosed.
Type:
Application
Filed:
December 12, 2013
Publication date:
June 12, 2014
Applicants:
Centre for Materials for Electronics Technology (C-MET), The Secretary, Dept. of Electronics and IT, Govt. of India