Abstract: A noise suppressing microphone employing a thin film of piezoelectric material sandwiched between two conductive layers, one of which is laminated to a flat inflexible laminate. The sandwich is embedded in a mechanical sound filter except for one exposed face which is placed in contact with a user's body for sound pickup.
Type:
Grant
Filed:
December 7, 1998
Date of Patent:
February 12, 2002
Assignee:
The United States of America as represented by the Sceretary
of the Navy
Inventors:
Edward F. Downs, Jr., Kevin M. Venturella