Abstract: The process of this invention involves first adsorbing a catalyst on the surface of a specimen by immersion in a catalyst-containing solution, followed by electrolytic deposition in a second solution that need not contain catalyst. This two-step superconformal process produces a seam-free and void-free metal microelectronic conductor.
Type:
Grant
Filed:
May 23, 2003
Date of Patent:
September 30, 2008
Assignee:
The United States of America as represented by the Secretary of Commerce, the National Insitiute of Standards & Technology
Inventors:
Daniel Josell, Thomas P. Moffat, Daniel Wheeler