Abstract: A thin-film thermocouple is provided which can be used at temperature of up to 900.degree. C. The thin-film thermocouple includes: a silicon substrate; an SiO.sub.2 diffusion barrier layer formed on the substrate; a titanium oxide adhesion layer formed on the diffusion barrier layer; a palladium thin film formed on the diffusion barrier layer; and a platinum thin film formed on the diffusion barrier layer and overlapping a portion of the palladium thin film to form a thermocouple junction.
Type:
Grant
Filed:
January 27, 1998
Date of Patent:
March 14, 2000
Assignee:
The United States of America as represented by the United States Department of Commerce
Abstract: A modified sulfur cement comprising the polymeric reaction product of elemental sulfur and a cyclopentadiene oligomer containing reactant.Cement compositions can be formulated by blending an aggregate material with the modified sulfur cement.
Type:
Grant
Filed:
October 16, 1979
Date of Patent:
January 19, 1982
Assignee:
The United States of America as represented by the United States Department of Commerce