Abstract: A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other.

Abstract: The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate for providing mechanical support and thermal dissipation; a fluid channel for directing a cooling fluid in the plane of the heat spreader; and a bottom plate for protecting against destructive shock events and for providing thermal dissipation. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention also relates to a ruggedized electronics enclosure for housing electronic components. A top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.

Abstract: A clamshell enclosure is disclosed for providing thermal and kinetic management for an enclosed electronic circuit. The clamshell enclosure comprises a sealed clamshell casing containing the circuit, and a cover that in combination with a wall of the clamshell casing forms a duct. A heat exchanger conducts heat from the electronic circuit inside the clamshell casing to a thermal interface element located within the duct, and a thermally conductive gas moving through the duct comes into contact with the interface element, dispelling the heat and thereby cooling the enclosed electronic circuit. A cellular topology of the clamshell casing and of the cover provides stiffness to the enclosure and reduces the effects of shock and vibration on the enclosed electronic circuit.

Abstract: The present invention relates to a ruggedized enclosure for housing and protecting electronic circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to for a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.