Patents Assigned to Therm-O-Disc Incorporated
  • Publication number: 20240096577
    Abstract: A temperature fuse assembly for a high-power DC circuit is provided. The temperature fuse assembly includes a case extending from a first case end to a second case end and an isolated lead projecting from the second case end. A bushing electrically isolates the isolated lead from the case. A high-gauge wire is electrically connected to the case at a first wire end and electrically connected to the isolated lead at a second wire end. A portion of the high-gauge wire is helically wound about an exterior of the bushing. When a temperature of the temperature fuse assembly exceeds a threshold temperature, the temperature fuse assembly is configured to conduct a DC current of the high-power DC circuit through the high-gauge wire. The high-gauge wire is configured to melt under a load of the DC current and interrupt the high-power DC circuit.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Changcai ZHAO, Lijuan HUANG, Wei SHI, Kangsheng LIN, Guojun XIAO, Rong GUAN, Xiang GONG, Qiang ZHAO
  • Publication number: 20230420210
    Abstract: The present disclosure relates to thermal cutoff device pellet composition. Provided is a pellet composition having enhanced aging performance, electrical performance, pellet output, pellet density and pellet crush strength for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound having a low vapor pressure at room temperature, such as tetraphenylsilane. The thermal pellet composition comprising tetraphenylsilane can significantly improve interruption performance, pellet output, pellet density, pellet crush strength and aging performance of the thermal cutoff device.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 28, 2023
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Changcai ZHAO, Wei SHI, Guojun XIAO, Rong Guan, Qiang Zhao, Xinping Shi, Kangsheng Lin
  • Publication number: 20230176007
    Abstract: A sensor includes a sensing element, a first pair of lead wires, a second pair of lead wires, a grommet, and a shell. The first pair of lead wires is fixed to the sensing element and configured to receive signals from the sensing element. The second pair of lead wires is electrically connected to the first pair of lead wires at a joint. The second pair of lead wires is configured to receive signals from the first pair of lead wires. The grommet houses the joint, a portion of the first pair of lead wires, and a portion of the second pair of lead wires. The shell houses the sensing element, the first pair of lead wires, and the grommet. The shell engages and deforms the grommet to seal an interior space defined by the shell.
    Type: Application
    Filed: September 30, 2022
    Publication date: June 8, 2023
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Jeffrey A. WEST, Richard Eugene GARRISON
  • Publication number: 20220357216
    Abstract: A temperature sensor including a body made from a thermally and electrically conductive material, the body defined by a peripheral wall extending along a longitudinal axis from an open proximal end to a closed distal end. The proximal end defining an opening to an internal cavity of the body. A thermally responsive element including an outer surface, a temperature sensitive resistor electrically connected to a first lead, a second lead, and a connector block disposed substantially within the internal cavity. The inner surface of the peripheral wall defines the shape of a right circular cone at the distal end. The outer surface of the temperature sensitive resistor is in direct contact with the inner surface of the peripheral wall at the distal end. One of a thermally conductive and curable potting material and a thermally conductive grease disposed in the cavity and substantially surrounding the temperature responsive element.
    Type: Application
    Filed: July 6, 2021
    Publication date: November 10, 2022
    Applicant: Therm-O-Disc Incorporated
    Inventors: Guokuan LIANG, Xiaojian WANG, Wenjie WU, Xiao LIU
  • Publication number: 20220262585
    Abstract: A metal housing or casing for a thermal fuse (i.e., a thermal cut-off device) that has a multilayer metal construction including a copper-based layer, a first nickel layer disposed on a first side of the copper-based layer and including an outer surface of the casing, a second nickel layer disposed on a second side of the copper-based layer opposite to the first side of the copper-based layer, and a single silver layer disposed only on the second nickel layer and comprising the inner surface of the casing.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 18, 2022
    Applicant: Therm-O-Disc Incorporated
    Inventors: Changcai ZHAO, Rong GUAN, Hongfang XIE
  • Patent number: 11047753
    Abstract: A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed and includes a pressure responsive component having a pressure sensitive element and an output signal generator disposed on a common substrate. The substrate has an aperture extending completely there through and the pressure sensitive element is disposed in communication with the aperture. The aperture is open to the ambient environment. The pressure responsive component is received in a connector which is received in a housing. Multiple seal structures isolate the pressure responsive component within the housing.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: June 29, 2021
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Indra J. Loomba, Chunming Li, HaiJian Liang, Zhouyu Zhao, Dong Peng, Amy Hertel
  • Publication number: 20200209091
    Abstract: A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed.
    Type: Application
    Filed: July 22, 2019
    Publication date: July 2, 2020
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Indra J. LOOMBA, Chunming LI, HaiJian LIANG, Zhouyu ZHAO, Dong PENG, Amy HERTEL
  • Patent number: 10249460
    Abstract: Provided is a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound have low ionization potential, such as dibenzosuberenone. The solid pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 160° C. greater than the Tf. The aging performance is further enhanced. Further, methods of enhanced processing and pelletizing are provided.
    Type: Grant
    Filed: September 1, 2014
    Date of Patent: April 2, 2019
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Changcai Zhao, Shi Wei
  • Patent number: 9779901
    Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: October 3, 2017
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Perry Kent, Truong Nguyen
  • Publication number: 20170278657
    Abstract: Provided is a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound have low ionization potential, such as dibenzosuberenone. The solid pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 160° C. greater than the Tf. The aging performance is further enhanced. Further, methods of enhanced processing and pelletizing are provided.
    Type: Application
    Filed: September 1, 2014
    Publication date: September 28, 2017
    Applicant: THERM-O-DISC. INCORPORATED
    Inventors: Changcai ZHAO, Shi WEI
  • Patent number: 9378910
    Abstract: A thermal cut-off device can include a case, a first electrically conductive lead disposed at a first end of the case, a thermally responsive pellet housed within the case, a second electrically conductive lead disposed at a second end of the case and having a distal end including a contact surface, an electrically conductive contact disposed between the pellet and the second lead, a first biasing member disposed between the pellet and the contact, and a second biasing member disposed between the contact and the second end of the case.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: June 28, 2016
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Truong Nguyen, George Clark
  • Publication number: 20160169713
    Abstract: A wireless sensor assembly for monitoring conditions in an ambient environment, such as for use in a climate control system for a data center is disclosed. The sensor assembly has a small form-factor housing extending along a longitudinal axis and defining an interior space. A sensor circuit is disposed within the housing and includes at least one sensor element for detecting temperature and/or humidity that is enclosed within a vented sub-chamber of the housing. A mounting member forming part of an exterior surface of the housing mounts the sensor assembly vertically along the at an installation location within an ambient environment being monitored.
    Type: Application
    Filed: October 24, 2013
    Publication date: June 16, 2016
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Timothy GRAFF, Gary D. DINGES, David CONNELL
  • Patent number: 9171654
    Abstract: The present disclosure provides a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. Certain inorganic stability additive particles, such as silica, talc, and siloxane, can be mixed with one or more organic compounds to form a thermal pellet composition. A solid thermal pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 50° C. greater than the Tf. In certain variations, maximum dielectric capability temperature (Tcap) is greater than or equal to about 380° C.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: October 27, 2015
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Katherine Hinrichs, Changcai Zhao
  • Publication number: 20150162153
    Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
    Type: Application
    Filed: January 9, 2015
    Publication date: June 11, 2015
    Applicant: THERM-O-DISC, INCORPORATED
    Inventors: Perry Kent, Truong Nguyen
  • Publication number: 20150145688
    Abstract: A sensor system and method for sensing conditions of a pipeline is disclosed. The system includes a plurality of sensors that sense a condition of the pipeline, generate a signal indicative of the condition, and communicate the signal. A pipeline device navigates the pipeline receives the signal, stores a value corresponding to the condition, and selectively communicates value.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Applicant: Therm-O-Disc, Incorporated
    Inventor: Timothy Graff
  • Publication number: 20150107379
    Abstract: A mount includes a sensor that is configured to output data characterizing the environment. A first portion has a receiving portion and a first aperture for receiving the sensor. The receiving portion fixes the sensor to the first portion. A positive location portion is located on the receiving portion and is adapted to receive the sensor. The positive location portion and first portion orient the position and depth of the sensor. A second portion is removably secured to the first portion to form a clamping structure for retaining the sensor.
    Type: Application
    Filed: October 22, 2013
    Publication date: April 23, 2015
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Derek J. Rose, Yicheng Pan, Gary D. Dinges, Richard E. Welch, Jared Starling, Donald G. Cunitz
  • Publication number: 20150091689
    Abstract: A thermal cut-off device can include a case, a first electrically conductive lead disposed at a first end of the case, a thermally responsive pellet housed within the case, a second electrically conductive lead disposed at a second end of the case and having a distal end including a contact surface, an electrically conductive contact disposed between the pellet and the second lead, a first biasing member disposed between the pellet and the contact, and a second biasing member disposed between the contact and the second end of the case.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 2, 2015
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Truong Nguyen, George Clark
  • Publication number: 20150082879
    Abstract: A thermo-anemometer-type fluid flow sensor and a method associated with quickly determining whether the sensor has been installed in an improper orientation relative to the direction of fluid flowing through a system. The flow sensor comprises a detection module adapted to change condition in response to the direction of fluid flowing through the system. A control module is connected to the probe and is capable of determining the installation orientation of a probe of the sensor. An I/O module is connected to the control module to provide a means for communicating the output of the control module to another device and/or user.
    Type: Application
    Filed: September 26, 2013
    Publication date: March 26, 2015
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Timothy Graff, Bernd D. Zimmermann
  • Publication number: 20150053151
    Abstract: The present disclosure provides a fluid flow sensor and low flow cut-off device and an associated method for its operation that is easily integrated into a fluid delivery and/or fluid control system for a variety of appliances, such as boilers and water heaters. The fluid flow sensor and low flow cut-off device can determine a fluid flow rate in or to an appliance and whether that fluid flow rate meets or exceeds a predetermined fluid flow rate threshold for the safe and/or efficient operation of the appliance and, if the threshold is not met, disable the appliance from operating or continuing to operate under such conditions.
    Type: Application
    Filed: August 22, 2013
    Publication date: February 26, 2015
    Applicant: Therm-O-Disc, Incorporated
    Inventor: Timothy Graff
  • Patent number: 8961832
    Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: February 24, 2015
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Perry Kent, Truong Nguyen