Patents Assigned to Therm-O-Disc Incorporated
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Publication number: 20240096577Abstract: A temperature fuse assembly for a high-power DC circuit is provided. The temperature fuse assembly includes a case extending from a first case end to a second case end and an isolated lead projecting from the second case end. A bushing electrically isolates the isolated lead from the case. A high-gauge wire is electrically connected to the case at a first wire end and electrically connected to the isolated lead at a second wire end. A portion of the high-gauge wire is helically wound about an exterior of the bushing. When a temperature of the temperature fuse assembly exceeds a threshold temperature, the temperature fuse assembly is configured to conduct a DC current of the high-power DC circuit through the high-gauge wire. The high-gauge wire is configured to melt under a load of the DC current and interrupt the high-power DC circuit.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Applicant: Therm-O-Disc, IncorporatedInventors: Changcai ZHAO, Lijuan HUANG, Wei SHI, Kangsheng LIN, Guojun XIAO, Rong GUAN, Xiang GONG, Qiang ZHAO
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Publication number: 20230420210Abstract: The present disclosure relates to thermal cutoff device pellet composition. Provided is a pellet composition having enhanced aging performance, electrical performance, pellet output, pellet density and pellet crush strength for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound having a low vapor pressure at room temperature, such as tetraphenylsilane. The thermal pellet composition comprising tetraphenylsilane can significantly improve interruption performance, pellet output, pellet density, pellet crush strength and aging performance of the thermal cutoff device.Type: ApplicationFiled: June 9, 2023Publication date: December 28, 2023Applicant: Therm-O-Disc, IncorporatedInventors: Changcai ZHAO, Wei SHI, Guojun XIAO, Rong Guan, Qiang Zhao, Xinping Shi, Kangsheng Lin
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Publication number: 20230176007Abstract: A sensor includes a sensing element, a first pair of lead wires, a second pair of lead wires, a grommet, and a shell. The first pair of lead wires is fixed to the sensing element and configured to receive signals from the sensing element. The second pair of lead wires is electrically connected to the first pair of lead wires at a joint. The second pair of lead wires is configured to receive signals from the first pair of lead wires. The grommet houses the joint, a portion of the first pair of lead wires, and a portion of the second pair of lead wires. The shell houses the sensing element, the first pair of lead wires, and the grommet. The shell engages and deforms the grommet to seal an interior space defined by the shell.Type: ApplicationFiled: September 30, 2022Publication date: June 8, 2023Applicant: Therm-O-Disc, IncorporatedInventors: Jeffrey A. WEST, Richard Eugene GARRISON
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Publication number: 20220357216Abstract: A temperature sensor including a body made from a thermally and electrically conductive material, the body defined by a peripheral wall extending along a longitudinal axis from an open proximal end to a closed distal end. The proximal end defining an opening to an internal cavity of the body. A thermally responsive element including an outer surface, a temperature sensitive resistor electrically connected to a first lead, a second lead, and a connector block disposed substantially within the internal cavity. The inner surface of the peripheral wall defines the shape of a right circular cone at the distal end. The outer surface of the temperature sensitive resistor is in direct contact with the inner surface of the peripheral wall at the distal end. One of a thermally conductive and curable potting material and a thermally conductive grease disposed in the cavity and substantially surrounding the temperature responsive element.Type: ApplicationFiled: July 6, 2021Publication date: November 10, 2022Applicant: Therm-O-Disc IncorporatedInventors: Guokuan LIANG, Xiaojian WANG, Wenjie WU, Xiao LIU
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Publication number: 20220262585Abstract: A metal housing or casing for a thermal fuse (i.e., a thermal cut-off device) that has a multilayer metal construction including a copper-based layer, a first nickel layer disposed on a first side of the copper-based layer and including an outer surface of the casing, a second nickel layer disposed on a second side of the copper-based layer opposite to the first side of the copper-based layer, and a single silver layer disposed only on the second nickel layer and comprising the inner surface of the casing.Type: ApplicationFiled: February 15, 2022Publication date: August 18, 2022Applicant: Therm-O-Disc IncorporatedInventors: Changcai ZHAO, Rong GUAN, Hongfang XIE
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Patent number: 11047753Abstract: A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed and includes a pressure responsive component having a pressure sensitive element and an output signal generator disposed on a common substrate. The substrate has an aperture extending completely there through and the pressure sensitive element is disposed in communication with the aperture. The aperture is open to the ambient environment. The pressure responsive component is received in a connector which is received in a housing. Multiple seal structures isolate the pressure responsive component within the housing.Type: GrantFiled: July 22, 2019Date of Patent: June 29, 2021Assignee: Therm-O-Disc, IncorporatedInventors: Indra J. Loomba, Chunming Li, HaiJian Liang, Zhouyu Zhao, Dong Peng, Amy Hertel
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Publication number: 20200209091Abstract: A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed.Type: ApplicationFiled: July 22, 2019Publication date: July 2, 2020Applicant: Therm-O-Disc, IncorporatedInventors: Indra J. LOOMBA, Chunming LI, HaiJian LIANG, Zhouyu ZHAO, Dong PENG, Amy HERTEL
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Patent number: 10249460Abstract: Provided is a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound have low ionization potential, such as dibenzosuberenone. The solid pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 160° C. greater than the Tf. The aging performance is further enhanced. Further, methods of enhanced processing and pelletizing are provided.Type: GrantFiled: September 1, 2014Date of Patent: April 2, 2019Assignee: Therm-O-Disc, IncorporatedInventors: Changcai Zhao, Shi Wei
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Patent number: 9779901Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.Type: GrantFiled: January 9, 2015Date of Patent: October 3, 2017Assignee: Therm-O-Disc, IncorporatedInventors: Perry Kent, Truong Nguyen
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Publication number: 20170278657Abstract: Provided is a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound have low ionization potential, such as dibenzosuberenone. The solid pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 160° C. greater than the Tf. The aging performance is further enhanced. Further, methods of enhanced processing and pelletizing are provided.Type: ApplicationFiled: September 1, 2014Publication date: September 28, 2017Applicant: THERM-O-DISC. INCORPORATEDInventors: Changcai ZHAO, Shi WEI
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Patent number: 9378910Abstract: A thermal cut-off device can include a case, a first electrically conductive lead disposed at a first end of the case, a thermally responsive pellet housed within the case, a second electrically conductive lead disposed at a second end of the case and having a distal end including a contact surface, an electrically conductive contact disposed between the pellet and the second lead, a first biasing member disposed between the pellet and the contact, and a second biasing member disposed between the contact and the second end of the case.Type: GrantFiled: October 2, 2013Date of Patent: June 28, 2016Assignee: Therm-O-Disc, IncorporatedInventors: Truong Nguyen, George Clark
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Publication number: 20160169713Abstract: A wireless sensor assembly for monitoring conditions in an ambient environment, such as for use in a climate control system for a data center is disclosed. The sensor assembly has a small form-factor housing extending along a longitudinal axis and defining an interior space. A sensor circuit is disposed within the housing and includes at least one sensor element for detecting temperature and/or humidity that is enclosed within a vented sub-chamber of the housing. A mounting member forming part of an exterior surface of the housing mounts the sensor assembly vertically along the at an installation location within an ambient environment being monitored.Type: ApplicationFiled: October 24, 2013Publication date: June 16, 2016Applicant: Therm-O-Disc, IncorporatedInventors: Timothy GRAFF, Gary D. DINGES, David CONNELL
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Patent number: 9171654Abstract: The present disclosure provides a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. Certain inorganic stability additive particles, such as silica, talc, and siloxane, can be mixed with one or more organic compounds to form a thermal pellet composition. A solid thermal pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 50° C. greater than the Tf. In certain variations, maximum dielectric capability temperature (Tcap) is greater than or equal to about 380° C.Type: GrantFiled: June 14, 2013Date of Patent: October 27, 2015Assignee: Therm-O-Disc, IncorporatedInventors: Katherine Hinrichs, Changcai Zhao
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Publication number: 20150162153Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.Type: ApplicationFiled: January 9, 2015Publication date: June 11, 2015Applicant: THERM-O-DISC, INCORPORATEDInventors: Perry Kent, Truong Nguyen
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Publication number: 20150145688Abstract: A sensor system and method for sensing conditions of a pipeline is disclosed. The system includes a plurality of sensors that sense a condition of the pipeline, generate a signal indicative of the condition, and communicate the signal. A pipeline device navigates the pipeline receives the signal, stores a value corresponding to the condition, and selectively communicates value.Type: ApplicationFiled: November 22, 2013Publication date: May 28, 2015Applicant: Therm-O-Disc, IncorporatedInventor: Timothy Graff
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Publication number: 20150107379Abstract: A mount includes a sensor that is configured to output data characterizing the environment. A first portion has a receiving portion and a first aperture for receiving the sensor. The receiving portion fixes the sensor to the first portion. A positive location portion is located on the receiving portion and is adapted to receive the sensor. The positive location portion and first portion orient the position and depth of the sensor. A second portion is removably secured to the first portion to form a clamping structure for retaining the sensor.Type: ApplicationFiled: October 22, 2013Publication date: April 23, 2015Applicant: Therm-O-Disc, IncorporatedInventors: Derek J. Rose, Yicheng Pan, Gary D. Dinges, Richard E. Welch, Jared Starling, Donald G. Cunitz
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Publication number: 20150091689Abstract: A thermal cut-off device can include a case, a first electrically conductive lead disposed at a first end of the case, a thermally responsive pellet housed within the case, a second electrically conductive lead disposed at a second end of the case and having a distal end including a contact surface, an electrically conductive contact disposed between the pellet and the second lead, a first biasing member disposed between the pellet and the contact, and a second biasing member disposed between the contact and the second end of the case.Type: ApplicationFiled: October 2, 2013Publication date: April 2, 2015Applicant: Therm-O-Disc, IncorporatedInventors: Truong Nguyen, George Clark
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Publication number: 20150082879Abstract: A thermo-anemometer-type fluid flow sensor and a method associated with quickly determining whether the sensor has been installed in an improper orientation relative to the direction of fluid flowing through a system. The flow sensor comprises a detection module adapted to change condition in response to the direction of fluid flowing through the system. A control module is connected to the probe and is capable of determining the installation orientation of a probe of the sensor. An I/O module is connected to the control module to provide a means for communicating the output of the control module to another device and/or user.Type: ApplicationFiled: September 26, 2013Publication date: March 26, 2015Applicant: Therm-O-Disc, IncorporatedInventors: Timothy Graff, Bernd D. Zimmermann
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Publication number: 20150053151Abstract: The present disclosure provides a fluid flow sensor and low flow cut-off device and an associated method for its operation that is easily integrated into a fluid delivery and/or fluid control system for a variety of appliances, such as boilers and water heaters. The fluid flow sensor and low flow cut-off device can determine a fluid flow rate in or to an appliance and whether that fluid flow rate meets or exceeds a predetermined fluid flow rate threshold for the safe and/or efficient operation of the appliance and, if the threshold is not met, disable the appliance from operating or continuing to operate under such conditions.Type: ApplicationFiled: August 22, 2013Publication date: February 26, 2015Applicant: Therm-O-Disc, IncorporatedInventor: Timothy Graff
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Patent number: 8961832Abstract: The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.Type: GrantFiled: January 17, 2012Date of Patent: February 24, 2015Assignee: Therm-O-Disc, IncorporatedInventors: Perry Kent, Truong Nguyen