Abstract: The apparatus is a heat sink for an integrated circuit chip which uses heat pipe cooling to remove the heat. The heat sink is a heat conductive structure such as a bowl which is associated with the integrated circuit socket, with the heat conductive structure held against the integrated circuit. A heat pipe is attached to the structure by using an extension from the heat conductive structure and wrapping the extension around a simple cylindrical heat pipe. One embodiment uses spring clips to attach the heat sink to the socket, and another version uses attachment screws through tabs which are formed from the material around a bowl shaped heat conductive structure.

Abstract: The disclosure is for a heat pipe in the form of a simple foil envelope and a method of constructing such a heat pipe. Two plastic coated metal foil sheets are sealed together on all four edges to enclose a semi-rigid channeled sheet of plastic foam, and the envelope is evacuated and loaded with a suitable quantity of liquid to act as a heat pipe. Despite the use of the essentially poor thermally conductive materials such as the plastic coating on the surface of the casing and the foam plastic for the wick, the apparatus operates well as a heat spreader for an integrated circuit chip placed in contact with the envelope surface. The heat is transferred across the thin plastic coating with only a small temperature differential, and the foam plastic wick with channels efficiently transports condensed liquid back to the heat input location for evaporation.

Abstract: The apparatus is a hybrid solar collector which permits heating by both solar energy and fossil fuels. The hollow solar collector structure acts as the vapor space for a heat pipe for which the heat utilization device acts as the condenser. A solar evaporator wick covers the inside surface of the solar collector, and one or more burners are located adjacent to the solar collector. Each burner has a burner evaporator wick mounted directly on the surface of the combustion chamber and the wick is either exposed within the vapor space of the solar heat pipe or made a part of an intermediate heat pipe which cools the combustion chamber surface and heats an auxiliary evaporator wick within the solar heat pipe. Thus, heat produced by either solar radiation or fuel combustion evaporates the working fluid in the solar heat pipe.

Abstract: The apparatus is a cooling structure for reaction engine throats. The constriction in the throat is cooled by a group of heat pipes which radiate outward from the constriction to a larger diameter perimeter surface where the heat is dissipated. The entire structure can be constructed by embedding pretested heat pipes around a base structure with plasma sprayed metal.

Abstract: The apparatus is a non-condensible gas venting device for vapor sources which can include a sonic orifice for vapor pressure reduction in high vapor pressure systems. A typical vapor source has a evaporator chamber with an evaporating wick containing liquid which is heated and produces vapor. The invention is a venting chamber connected to the evaporator chamber so that the vapor has access to the venting chamber. The venting chamber also includes a condensing wick interconnected to the evaporating wick in the evaporator chamber by a capillary capillary device through which the condensed liquid is returned to the evaporating wick. The condenser chamber is vented to a lower pressure region or vacuum so that non-condensible gas present moves out of the condenser chamber into the lower pressure while the vapor is trapped by the condensing wick and is retained in the system.

Abstract: The apparatus is a rapid response evaporator for material deposition in vapor. The structure is a vessel which is heated to a temperature just above the melting temperature of the liquid which it contains. Inserted into the heated liquid is a funnel shaped evaporator structure in which the vertical tube is a capillary structure to raise the heated liquid from the vessel. The upper diverging portion of the evaporator contains a porous capillary interior coating in contact with the capillary tube, and the exterior is independently heated. Because of the low thermal mass of the upper portion of the evaporator and the liquid in its capillary structure, it can respond to heat changes quickly enough to rapidly vary the rate of evaporation and the thickness of the deposited coating.

Abstract: The apparatus is a cooling device for an integrated circuit chip which includes a heat conductive pad for contact with the top surface of the chip and for attachment to a heat pipe to dispose of the heat. One surface of the pad is flat and contacts the circuit chip while the opposite surface of the pad is attached to a simple cylindrical heat pipe. The pad includes extensions from its sides to which a holding fixture applies force so that the pad is held tightly against the chip. The holding fixture is held on the mounting board by screws while the top of the pad which is attached to the heat pipe protrudes through a hole in the holding fixture. A finned heat exchanger is attached to an end of the heat pipe remote from the conductive pad.

Abstract: The disclosure is for a method of bonding materials with severely mismatched coefficients of thermal expansion, such as carbon/carbon and a composite of aluminum oxide and niobium and for the structure of the bonded joint. The key to a good bond between such materials is the use of a thin layer of porous sintered metal as an intermediate material which is bonded to the two diverse thermal expansion materials. The sintered material has a porosity of 20 to 80 percent, and stays bonded to both of the different material surfaces while the sintered material itself is also not destroyed by the thermal stress.

Abstract: The apparatus is a combined Alkali Metal Thermal to Electric Converter (AMTEC) and a thermionic energy converter which are mated by the use of a common heat transfer device which can be a heat pipe, pumped fluid or a simple heat conduction path. By adjusting the heat output surface area of the thermionic converter and the heat input surface area of the AMTEC, the heat transfer device accomplishes not only the transfer of heat from the output of the thermionic converter to the input of the AMTEC, but also the transformation of the heat density to match the requirements of the AMTEC input. The electrical current through the combined devices is also matched by adjusting the heated surface area of the AMTEC.

Abstract: The apparatus is a cooling structure for reaction engine throats. The constriction in the throat is cooled by a group of heat pipes which radiate outward from the constriction to a larger diameter perimeter surface where the heat is dissipated. The entire structure can be constructed by embedding pretested heat pipes around a base structure with plasma sprayed metal.

Abstract: The invention is a cooling structure for a high power density surface. Fluid is pumped along interconnected and continuous multiple channels on the backside of a sintered metal wick bonded to the cooled surface. The channels are located within a fluid layer which also includes multiple fluid holes, so that each hole is surrounded by interconnected channels. The holes are connected to a manifold to collect or supply the pumped fluid. The channels which surround each hole are connected to another manifold attached to the structure, and the proximity of the channels to the holes assures that fluid flow resistance within the sintered metal wick is minimized by the multiple short, wide paths.

Abstract: A heater which uses the electrolysis of a liquid to produce heat from electricity and transfers the heat from the electrolyte by means of a heat exchanger. One embodiment includes electrodes of nickel and platinum and an electrolyte of potassium carbonate with a heat exchanger immersed in and transferring heat from the electrolyte.

Abstract: The invention is a cooling structure for a high power density surface. Liquid is pumped along interconnected and continuous multiple channels on the backside of a sintered metal wick bonded to the cooled surface. The channels are located within a liquid delivery layer which also includes multiple liquid outlet holes, so that each outlet hole is surrounded by interconnected channels. The outlet holes are connected to a manifold to collect the pumped liquid. The input channels which surround each outlet hole are fed from manifolds at the edges of the panels, and the proximity of input channels to the outlet holes assures that liquid flow resistance within the sintered metal wick is minimized by the multiple short, wide paths.

Abstract: A thermionic electric converter module integrated with heating and cooling heat pipes. Two heat pipes are arranged concentrically, with the annular emitter heat pipe on the outside of the module to isothermally distribute heat from a source located in any direction around the unit to the emitter located on the inside exterior wall of the heat pipe. The exterior wall surface of the collector heat pipe, located inside the annular emitter heat pipe, is separated from the emitter by the thermionic converter's interelectrode gap and serves as the collector of the thermionic converter. The collector heat pipe is of conventional cylindrical configuration and transports the waste heat of the thermionic converter along the unit's axis to a remote location for disposal.

Abstract: A heat pipe cooling plate in which one or more heat pipes sandwiched between cover plates is an expandable heat pipe made with thin flexible walls forming the heat pipe casing. One advantage of such an expandable heat pipe within the cooling plate structure is that the heat pipe need not be bonded to the outer casing. Instead, the heat pipe balloons out when the vapor pressure increases upon heating, and the flexible heat pipe casing moves into intimate contact with the boundary surfaces of the cooling plate.

Abstract: A high permeability wick structure for heat pipes. A thin capillary liquid transport structure is encased within relatively thick sections of a plastic bonded aluminum powder wick. The capillary structure is formed of two layers of fine mesh screen separated only by small, randomly located, powdered metal granules. The capillary liquid transport structure can be built in numerous cross sectional configurations, including annular rings or spoke like radial sections.

Abstract: A heat transfer surface structure for cooling high power density surfaces and the method of constructing it. The surface includes a sintered capillary layer with a complex configuration of tunnels within it constructed adjacent to the heated surface which is subject to very high power densities. The tunnel arteries serve to supply evaporable liquid and remove vapor to provide the cooling. A unique method of constructing the tunneled sintered layer is also described.

Abstract: A heat pipe which maintains a controlled temperature gradient over its length. An annular heat pipe is constructed to have a core area which is a working furnace and to have the heat input at one end and a heat sink at the other end of the annular structure. The core is surrounded by an annular vapor space with a restricted cross section. The reduced vapor space creates a temperature gradient over the length of the furnace, and this gradient is variable and controllable depending upon the quantity of heat being transferred from the heat source to the heat sink.

Abstract: An artery vapor trap. A heat pipe artery is constructed with an extension protruding from the evaporator end of the heat pipe beyond the active area of the evaporator. The vapor migrates into the artery extension because of gravity or liquid displacement, and cooling the extension condenses the vapor to liquid, thus preventing vapor lock in the working portion of the artery by removing vapor from within the active artery. The condensed liquid is then transported back to the evaporator by the capillary action of the artery extension itself or by wick located within the extension.

Abstract: A flat cooling plate which is assembled with individual heat pipes which are annealed, flattened tubes with sintered wicks formed within them. The completely constructed and pre-tested heat pipes are set into slots in a spacer plate which is sandwiched between two unslotted flat sheets. For assembly, bonding material is placed between the slotted plate and unslotted sheets, and the assembly is heated to the bonding material working temperature while compressed in a press in order to prevent damage from excessive internal heat pipe pressure.