Patents Assigned to Thermal Dynamics U.S.A. Ltd. Co.
  • Patent number: 5616266
    Abstract: A large-area, thin film, resistance heating element (21, 46, 81) including a relatively rigid substrate (22, 63, 82), which will retain its mechanical properties at elevated temperatures, an electrically conductive film (26, 64, 84) deposited on the substrate (21, 46, 81), and electrical terminals (31, 66, 86) provided on the film (26, 64, 84). A metallic substrate (22, 63), such as a steel sheet, having an electrically insulating ceramic-based layer (23, 62, 83) thereon may be employed, or alternatively, a micanite plate or sheet (61) can be used. The substrate and film have an area which is sufficiently large that the heater can operate at maximum temperatures above 100.degree. F. with a power density less than about 15 watts per square inch.
    Type: Grant
    Filed: July 29, 1994
    Date of Patent: April 1, 1997
    Assignee: Thermal Dynamics U.S.A. Ltd. Co.
    Inventor: Richard P. Cooper