Patents Assigned to Thermal Form & Function
  • Corrugated matrix heat sink for cooling electronic components
    Patent number: 6615909
    Abstract: An improved heat sink is used to cool electrical and electronic components that generate heat. The heat sink comprises at least one primary corrugated fin pack having a continuous series of vertically extending fins defining channels between adjacent pairs of the vertically extending fins. At least one secondary corrugated fin pack fits within the channels of the primary corrugated fin pack, creating a fin pack matrix. The fin pack matrix is then attached to a base plate.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: September 9, 2003
    Assignee: Thermal Form & Function
    Inventor: David W. Fast
  • Pumped liquid cooling system using a phase change refrigerant
    Patent number: 6519955
    Abstract: An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: February 18, 2003
    Assignee: Thermal Form & Function
    Inventor: Joseph Marsala
  • Cold plate utilizing fin with evaporating refrigerant
    Patent number: 6508301
    Abstract: An improved cold plate cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate. A fin material is inserted in the cold plate and refrigerant is circulated through the fin, allowing the cold plate and fin to transfer heat from the electrical or electronic components, as the liquid refrigerant is at least partially evaporated by the heat generated by the components.
    Type: Grant
    Filed: April 17, 2001
    Date of Patent: January 21, 2003
    Assignee: Thermal Form & Function
    Inventor: Joseph Marsala
  • Convoluted fin heat sinks with base topography for thermal enhancement
    Patent number: 6260610
    Abstract: A system and method are provided for enhancing thermal performance of a heat transfer device. A fin pack is generated from a flat sheet of metal, the fin having a plurality of radiussed conduit top portions and a reciprocal plurality of radiussed conduit bottom portions, for transferring heat. The radiussed conduit bottom portions of the fin are attached to a base plate. The base plate comprises a series of grooves and risers for closely approximating the shape of the radiussed conduit portions. The radiussed fin portions nest in the configuration of grooves and risers to maximize the contact area between the fin and the base plate.
    Type: Grant
    Filed: March 5, 1999
    Date of Patent: July 17, 2001
    Assignee: Thermal Form & Function
    Inventors: Catharina R. Biber, Vincent Campanella