Abstract: Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.

Abstract: A modular cooling system can include thermal bridges for separate modules of a computer system that passively transfer heat away from heat sources of the modules. The thermal bridges can be thermally connected to a cold plate having a fluid path for liquid coolant. The cold plate can be positioned in, or linked to, a cooling dock having a pump and at least one cooling element such as a radiator or fan system. Heat from separate modules can be passively transferred via thermal bridges to cold plates, where liquid pumped through the cold plates can transfer the heat to the cooling elements of the cooling dock to be dissipated.

Abstract: Modular thermal truss plates carry heat in multiple directions. Framing around an array of flat heat pipes provides mechanical and thermal connections to other truss plates, and a base, such as a satellite, thereby supporting thermally active equipment. Walls sandwich banks of flat heat pipes and may bond to a honey comb, metal core conducting heat between multiple walls. Each bank of flat heat pipes passes heat best in one direction, and may be formed of corrugated copper sheets spaced apart by a metal mesh, such as an expanded metal or screen, also stamped or otherwise formed into a corrugated configuration. Joining methods (e.g., brazing, soldering, etc.) increase stiffness, pressure containment, and strength, by binding the two layers of metal sheet to one another.

Abstract: Modular thermal truss plates carry heat in multiple directions. Framing around an array of flat heat pipes provides mechanical and thermal connections to other truss plates, and a base, such as a satellite, thereby supporting thermally active equipment. Walls sandwich banks of flat heat pipes and may bond to a honey comb, metal core conducting heat between multiple walls. Each bank of flat heat pipes passes heat best in one direction, and may be formed of corrugated copper sheets spaced apart by a metal mesh, such as an expanded metal or screen, also stamped or otherwise formed into a corrugated configuration. Joining methods (e.g., brazing, soldering, etc.) increase stiffness, pressure containment, and strength, by binding the two layers of metal sheet to one another.