Patents Assigned to THERMAVANT TECHNOLOGIES LLC
  • Integrated circuit with integrally formed micro-channel oscillating heat pipe
    Patent number: 11769709
    Abstract: A miniaturized oscillating heat pipe (OHP) embedded within an integrated circuit (IC) is provided. The miniaturized oscillating heat pipe (OHP) integrally formed within an integrated circuit (IC) is fabricated to form a monolithic IC device using silicon (or similar future semiconductors) fabrication techniques. The OHP is operable to transfer high local heat fluxes within the IC device to more accessible locations on the IC device for heat rejection to an available heat sink.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: September 26, 2023
    Assignee: THERMAVANT TECHNOLOGIES, LLC
    Inventors: Christopher D. Smoot, Joe Boswell, Corey Wilson
  • Multiple Thermal Circuit Heat Spreader
    Publication number: 20130133871
    Abstract: A heat spreader has more than one thermal circuit to give better performance over a wider range of heat input regimes. Different working fluids may be used in the different thermal circuits. The thermal circuits may extend in three dimensions to improve the density of the channels in limited space.
    Type: Application
    Filed: April 12, 2011
    Publication date: May 30, 2013
    Applicants: THERMAVANT TECHNOLOGIES LLC, THE CURATORS OF THE UNIVERSITY OF MISSOURI
    Inventors: Hongbin Ma, Peng Cheng, Joseph A. Boswell