Abstract: A heat rejection panel that comprises a chassis having a first side, an opposing second side, and an aperture extending therethrough. The panel additionally comprises at least one oscillating heat pipe (OHP) plate disposed over a portion of the first side and/or the second side of the chassis. Each OHP plate includes a first face, an opposing second face, and a plurality of internal OHP channels. A portion of the first face and/or second face of each OHP plate is accessible for thermal interfacing with a heat source. A portion of the second face of each OHP plate is accessible for thermal interfacing with a heat sink. Each OHP plate will remove heat from the heat source, spread the removed heat throughout each OHP plate to provide an isothermal OHP plate, and reject the heat to the heat sink.

Abstract: A miniaturized oscillating heat pipe (OHP) embedded within an integrated circuit (IC) is provided. The miniaturized oscillating heat pipe (OHP) integrally formed within an integrated circuit (IC) is fabricated to form a monolithic IC device using silicon (or similar future semiconductors) fabrication techniques. The OHP is operable to transfer high local heat fluxes within the IC device to more accessible locations on the IC device for heat rejection to an available heat sink.

Abstract: A heat rejection panel comprising a first and a second plate. The first plate comprises an oscillating heat pipe face having a plurality of first opened elongated recesses formed therein, and the second plate comprises an oscillating heat pipe face having a plurality of second open elongated recesses formed therein. The first plate oscillating heat pipe face is hermetically sealed to the second plate oscillating heat pipe face forming a bond joint therebetween. The first plate caps the second open elongated recesses and the second plate caps the first open elongated recesses such that first open elongated recesses are physically and fluidly connected to the second open elongated recesses, thereby forming at least one non-planar oscillating heat pipe channel within the panel that reciprocates back and forth across the bond joint having the bond joint as a longitudinal axis.

Abstract: A thermal management system for the at least one energy cell. The thermal management system includes a cold plate cell holder comprising at least one energy cell reservoir structured to retain the energy cell(s) and surround at least a first portion of a surface of the energy cell(s), and to thermally cool the energy cell(s). The system additionally includes a bus bar header to which one or more bus bar can be physically and thermally connected, and at least one oscillating heat pipe (OHP) cover disposable around a second portion of the surface of the energy cell(s). The OHP cover(s) is/are thermally and mechanically connectable to the cold plate cell holder when disposed around the energy cell(s). The OHP cover(s) is/are structured and operable to thermally cool the energy cell(s) via heat absorption from the second portion of the surface of the energy cell(s) when disposed around the energy cell(s).

Abstract: A thermally driven heat pump includes a low temperature evaporator for evaporating cooling fluid to remove heat A first heat exchanger located at an outlet of a converging/diverging chamber of a first ejector receives a flow of primary fluid vapor and cooling fluid vapor ejected from the first ejector for condensing a portion of the cooling fluid vapor An absorber located in the first heat exchanger absorbs cooling fluid vapor into an absorbing fluid to reduce the pressure in the first heat exchanger A second heat exchanger located at an outlet of a converging/diverging chamber of a second ejector receives primary fluid vapor and cooling fluid vapor ejected from the second ejector for condensing the cooling fluid vapor and the primary fluid vapor A separator in communication with the second ejector, the low temperature evaporator and the primary fluid evaporator separates the primary fluid from the cooling fluid.

Abstract: A heat spreader has more than one thermal circuit to give better performance over a wider range of heat input regimes. Different working fluids may be used in the different thermal circuits. The thermal circuits may extend in three dimensions to improve the density of the channels in limited space.