Abstract: A thermal joint for facilitating heat transfer between two components is described. The thermal joint is formed from an alloy of at least two constituents. The alloy has a liquid temperature and a solid temperature. When the operating temperature falls between the liquid temperature and the solid temperature, the alloy has at least one liquid phase which is in substantial equilibrium with at least one solid phase. The thermal joint is used between a heat-generating component, such as a semiconducting device, and a heat-dissipating component, such as a heat sink. Such thermal joint substantially reduces the thermal resistance between the two components.