Abstract: Disclosed are integrity-enhanced thermoelectric devices and methods of their preparation. Such devices have the following characteristics: (1) there is, on average, no greater than about 10% incidence of function loss (failure) of the device on application to the device of a substantial impact or distortion force or corrosion exposure, and (2) the device have at least about 85% of the thermal performance of thermoelectric devices without integrity enhancement (i.e., thermal conductivity across the integrity-enhanced devices is significantly less than 0.0021 Cal-Cm/Cm.sup.2 Sec .degree.C., and is less than or equal to about 0.0015 Cal-Cm/Cm.sup.2 Sec .degree.C.; empirically expressed as maintenance of at least a 40.degree. C. temperature differential over the intra-plate distance which is about 3/16 to about 1/4 of an inch.).

Abstract: A method for the manufacture of ultrafine particles or atom clusters is disclosed. The ultrafine particles of size between about 10 to 1000 Angstroms are formed by the disruption of the crystal lattice or micrograin structure of the metal, alloy or intermetallic compound in one or both of two spaced electrodes by a high frequency, high voltage, high peak current discharge. The ultrafine particles are not subjected to fractionation as in evaporative processes and accordingly are remarkably predictable in both particle size, distribution of sizes and atomic composition, and also are readily transportable in carrier gases.

Abstract: A method for the manufacture of ultrafine particles or atom clusters is disclosed. The ultrafine particles of size between about 10 to 1000 Angstroms are formed by the disruption of the crystal lattice or micrograin structure of the metal, alloy or intermetallic compound in one or both of two spaced electrodes by a high frequency, high voltage, high peak current discharge. The ultrafine particles are not subjected to fractionation as in evaporative processes and accordingly are remarkably predictable in both particle size, distribution of sizes and atomic composition, and also are readily transportable in carrier gases.