Abstract: An embodiment of the present invention is a temperature forcing system and method for precision temperature control of a device-under-test. The system comprises a thermal test head suspended by a support arm that receives a temperature controlled air flow through an output hose from an air supply system. A pair of temperature sensors, one attached to the device-under-test and the other in the output hose, are used differentially by a closed-loop temperature controller when the temperature of the device-under-test comes within a temperature window surrounding a target temperature setpoint point. Outside the temperature window control is linear and within the temperature window control is compensated by a correction factor obtained during a single calibration test that amalgamates the effects of the mass of the device-under-test, the ambient conditions and other factors.

Abstract: A device for individually testing semiconductor integrated circuits in wafer form at elevated and/or reduced temperatures include a fixture body for connection to a conventional probing device. The fixture body has an open-ended aperture to permit visual inspection of a circuit being tested, a plenum to receive pressurized gas at a selected temperature(s), and nozzles to direct the gas from the plenum into the aperture for ejection onto to the surface of the integrated circuit being tested to rapdily bring that circuit to the temperature of the gas.

Abstract: A device for individually testing semiconductor integrated circuits in wafer form at elevated and/or reduced temperatures include a fixture body for connection to a conventional probing device. The fixture body has an open-ended aperture to permit visual inspection of a circuit being tested, a plenum to receive pressurized gas at a selected temperature(s), and nozzles to direct the gas from the plenum into the aperture for ejection onto the surface of the integrated circuit being tested to rapidly bring that circuit to the temperature of the gas.