Patents Assigned to Thermovonics Co., Ltd.
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Patent number: 6038865Abstract: A temperature-controlled appliance is provided with mutually-independent temperature-controlled compartments arranged close to each other. Each of the compartments comprises a casing formed of a heat-insulating layer, a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite a storage space in the casing, a Peltier device thermally connected with the thermal conductor, a power supply for feeding electric power to the Peltier device, and a controller for controlling electric power to be fed to the Peltier device so that a temperature in the casing is controlled.Type: GrantFiled: July 16, 1997Date of Patent: March 21, 2000Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Motohiro Sakai, Hirofusa Tezuka
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Patent number: 6034317Abstract: One of a heat-absorbing-side thermal conductor and a heat-dissipating-side thermal conductor is substantially in a form of a single piece. Plural groups of thermoelectric elements are arranged relative to the single-piece thermal conductor. Corresponding to the plural groups of thermoelectric elements, the other one of the heat-absorbing-side thermal conductor and the heat-dissipating-side thermal conductor is arranged in a form divided into a like number of pieces.Type: GrantFiled: October 21, 1997Date of Patent: March 7, 2000Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Fumikazu Kiya, Mitsutoshi Ogasawara
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Patent number: 5987892Abstract: A storage box apparatus makes use of thermoelectric modules as devices for cooling or heating storage units, respectively. Each thermoelectric module is provided with a heat-dissipating-side base and a heat-absorbing-side base. A liquid heat transfer medium is spouted against a surface of the heat-dissipating-side base substantially at a right angle.Type: GrantFiled: December 24, 1997Date of Patent: November 23, 1999Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Fumikazu Kiya
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Patent number: 5956965Abstract: A watercooler is provided with a vessel for storing water therein; a heater for boiling the water in the vessel; a pump for lifting the boiled water; a primary cooling unit (e.g., air-cooled heat exchanger tube and a fan) for subjecting to primary cooling the boiled water lifted by the pump; a secondary cooling unit (e.g., the fan, a heat-dissipating-side thermal conductor, a thermoelectric module, a heat-absorbing-side thermal conductor, and a cold water pipe) for subjecting the water, which has been subjected to the primary cooling, to secondary cooling by using the thermoelectric module; and a service unit for dispensing the cold water subsequent to the secondary cooling.Type: GrantFiled: October 15, 1997Date of Patent: September 28, 1999Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Motohiro Sakai
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Patent number: 5931001Abstract: An air-conditioning ventilator is provided with an air inlet passage and an air outlet passage for ventilation and also with a heat exchanger making use of a thermoelectric module for effecting an exchange of heat with air flowing through one of the passages. At least one of a heat-absorbing system and a heat-dissipating system of the heat exchanger is provided with a heat-transfer-medium-circulating system so that a heat transfer medium is forced to circulate in a liquid form for performing the exchange of heat.Type: GrantFiled: June 10, 1997Date of Patent: August 3, 1999Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Motohiro Sakai, Fumikazu Kiya
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Patent number: 5927078Abstract: A thermoelectric refrigerator is provided with a casing formed of a heat-insulating layer, thermal conductors arranged in the casing and having a heat transfer surface located facing a storage space in the casing, a Peltier device thermally connected with the thermal conductors, a device power supply for supplying electric power to the Peltier device, an interior fan for causing interior air to flow in the storage space, a fan power supply for supplying electric power to the interior fan, and a control unit for controlling a quantity of electric power to be supplied to the interior fan in accordance with a quantity of electric power to be supplied to the Peltier device.Type: GrantFiled: November 13, 1997Date of Patent: July 27, 1999Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Fumikazu Kiya
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Patent number: 5845497Abstract: An electric refrigerator is provided with a casing formed of a heat-insulating layer and defining an opening; a heat-insulating door for openably closing the opening of the casing; a thermal conductor arranged in the casing and provided with a heat-conducting surface located opposite an interior space in the casing; a Peltier device thermally connected with the thermal conductor; and a device power supply for feeding electric power to the Peltier device. The electric refrigerator is also provided with a control unit for controlling the device power supply so that, after the heat-insulating door is closed subsequent to opening thereof, the device power supply supplies the Peltier device with electric power controlled in a range of from 1.3 to 2 times as much rated electric power required to maintain a preset interior temperature of the casing.Type: GrantFiled: December 24, 1997Date of Patent: December 8, 1998Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Fumikazu Kiya, Katsuhiro Tsuno
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Patent number: 5715684Abstract: A thermoelectric converter is composed of a number of p-type semiconductor chips and n-type semiconductor chips arranged side by side and electrically connected in series, a heat-absorbing-side heat conductor arranged on a heat-absorbing side of the p-type and n-type semiconductor chips, a heat-dissipating-side heat conductor arranged on a heat-dissipating side of the p-type and n-type semiconductor chips, and a device for feeding a current to the p-type and n-type semiconductor chips. The current feeding device feeds a current of a density in a current density range selected depending on a thickness of said p-type and n-type semiconductor chips.Type: GrantFiled: March 4, 1996Date of Patent: February 10, 1998Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Yoshihiko Ogawa, Motohiro Sakai, Fumio Hisano, Hirohusa Tezuka, Fumikazu Kiya
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Patent number: 5409547Abstract: A thermoelectric cooling device for a thermoelectric refrigerator is described. The device is composed of p-type and n-type semiconductor layers, a first inner heat conductor, a first outer heat conductor, a second inner heat conductor, and a second outer heat conductor. The p-type and n-type semiconductor layers are electrically connected in series via the electrodes. The p-type and n-type semiconductor layers have a specific average thickness. The average figures of merit of the p-type and n-type semiconductor layers are controlled to a particular value. The thermal conductances of the first and second, inner and outer heat conductors fall within specific ranges, respectively. The coefficient of performance defined in terms of the ratio of the quantity of absorbed heat to inputted power is at least 0.6. Also described are a process for the fabrication of a semiconductor suitable for use in the thermoelectric cooling device and also a thermoelectric refrigerator using the thermoelectric cooling device.Type: GrantFiled: September 30, 1993Date of Patent: April 25, 1995Assignee: Thermovonics Co., Ltd.Inventors: Hideo Watanabe, Motohiro Sakai, Fumio Hisano, Atsushi Osawa, Hirofusa Tezuka