Abstract: The present invention refers to a method for applying a smoothening layer on a band substrate for subsequent manufacturing a high temperature superconductor tape, wherein the method comprises the steps: (a) applying a liquid containing polysilazane on at least one side of the band substrate; and (b) heating the liquid containing polysilazane to a temperature?450° C. for depositing a layer on the band substrate which comprises silicon oxynitride (SiNxOy, wherein 0?x<0.6 and 1.0<y?2.0), and/or silicon-carbon-oxynitride (SiCxNyOz, 2·y<x?1.0, 0<y<0.2 and 1.0<z?2.0).

Abstract: The present invention refers to a method for applying a smoothening layer on a band substrate for subsequent manufacturing a high temperature superconductor tape, wherein the method comprises the steps: (a) applying a liquid containing polysilazane on at least one side of the band substrate; and (b) heating the liquid containing polysilazane to a temperature?450° C. for depositing a layer on the band substrate which comprises silicon oxynitride (SiNxOy, wherein 0?x<0.6 and 1.0<y?2.0), and/or silicon-carbon-oxynitride (SiCxNyOz, 2·y<x?1.0, 0<y<0.2 and 1.0<z?2.0).

Abstract: A laminate includes an amorphous or polycrystalline substrate; a textured buffer layer arranged on the substrate and having a columnar structure wherein a low index crystal axis is inclined with respect to the substrate normal and a surface of columnar crystallites is inclined with respect to the low index crystal axis; at least one cover layer arranged on the buffer layer and having a closed surface; and an oriented thin layer.

Abstract: The invention relates to an apparatus for the production of thin oxide coatings, having a vacuum chamber wherein an oxygen chamber with an opening and a rotary substrate holder overlapping the latter are disposed. For the rotary arrangement of the substrate holder a rotary mounting is provided, which engages a circumferential portion of the substrate holder.

Abstract: In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle &agr;1≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated. According to the invention, provision is made such that (a) following evaporation of the buffer layer and prior to the evaporation of the oriented thin layer, at least one cover layer is evaporated under deposition conditions that vary from those under which the buffer layer was applied, especially at a different pressure, different temperature, different rate, and/or different angle &agr;2≠&agr;1, especially &agr;2<&agr;1, preferably &agr;2≈0° to the substrate surface normal, and/or is evaporated on the buffer layer in such fashion that the buffer layer has a biaxial texture and/or facets.

Abstract: The invention relates to a laminate with, one after the other, amorphous or polycrystalline substrate, a textured buffer layer, and an oriented thin layer. In addition, at least one cover layer is contained between the buffer layer and the thin layer. In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle &agr;1≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated.