Abstract: The present invention refers to a method for applying a smoothening layer on a band substrate for subsequent manufacturing a high temperature superconductor tape, wherein the method comprises the steps: (a) applying a liquid containing polysilazane on at least one side of the band substrate; and (b) heating the liquid containing polysilazane to a temperature?450° C. for depositing a layer on the band substrate which comprises silicon oxynitride (SiNxOy, wherein 0?x<0.6 and 1.0<y?2.0), and/or silicon-carbon-oxynitride (SiCxNyOz, 2·y<x?1.0, 0<y<0.2 and 1.0<z?2.0).

Abstract: The invention relates to a high temperature superconducting tape conductor having a flexible metal substrate that comprises at least one intermediate layer disposed on the flexible metal substrate and comprising terraces on the side opposite the flexible metal substrate, wherein a mean width of the terraces is less than 1 ?m and a mean height of the terraces is more than 20 nm, and that comprises at least one high temperature superconducting layer disposed on the intermediate layer, which is disposed on the at least one intermediate layer and comprises a layer thickness of more than 3 ?m. The ampacity of the high temperature superconducting tape conductor relative to the conductor width is more than 600 A/cm at 77 K.

Abstract: The present invention refers to a method for applying a smoothening layer on a band substrate for subsequent manufacturing a high temperature superconductor tape, wherein the method comprises the steps: (a) applying a liquid containing polysilazane on at least one side of the band substrate; and (b) heating the liquid containing polysilazane to a temperature?450° C. for depositing a layer on the band substrate which comprises silicon oxynitride (SiNxOy, wherein 0?x<0.6 and 1.0<y?2.0), and/or silicon-carbon-oxynitride (SiCxNyOz, 2·y<x?1.0, 0<y<0.2 and 1.0<z?2.0).

Abstract: The invention relates to a high temperature superconducting tape conductor having a flexible metal substrate that comprises at least one intermediate layer disposed on the flexible metal substrate and comprising terraces on the side opposite the flexible metal substrate, wherein a mean width of the terraces is less than 1 ?m and a mean height of the terraces is more than 20 nm, and that comprises at least one high temperature superconducting layer disposed on the intermediate layer, which is disposed on the at least one intermediate layer and comprises a layer thickness of more than 3 ?m. The ampacity of the high temperature superconducting tape conductor relative to the conductor width is more than 600 A/cm at 77 K.

Abstract: According to a first aspect the present invention relates to a fault current limiter formed by a conductor tape (11, 41, 51, 61, 71) coated with a high temperature superconductor and having at least one mounting element (12, 42, 52, 62, 72) which is essentially holding the conductor tape solely on one or more edge regions in such a way that the principal surfaces of the tape cannot get in touch with the mounting element. According to a second aspect the present invention relates to a fault current limiter formed by a conductor tape coated with a high temperature superconductor and comprising at least one mounting element (23, 24) which is contacting the conductor tape on one or on both major surfaces in an electrically conducting manner such that the conductor tape (21) in its normal conducting state is electrically shunted by the mounting element (23) in the contact region.

Abstract: According to a first aspect, the present invention relates to a device for depositing a high temperature superconductor onto a substrate in vacuum comprising a refilling device for containing a stock of high temperature superconductor material, an evaporation device, that evaporates the high temperature superconductor material within an evaporation zone by means of an energy transferring medium, and a conveyor that transports the high temperature superconductor material continuously from the refilling device to the evaporation zone in such a way that the high temperature superconductor material delivered into the evaporation zone is evaporated essentially without residues.

Abstract: According to a first aspect the present invention relates to a fault current limiter formed by a conductor tape (11, 41, 51, 61,71) coated with a high temperature superconductor and having at least one mounting element (12, 42, 52, 62, 72) which is essentially holding the conductor tape solely on one or more edge regions in such a way that the principal surfaces of the tape cannot get in touch with the mounting element. According to a second aspect the present invention relates to a fault current limiter formed by a conductor tape coated with a high temperature superconductor and comprising at least one mounting element (23, 24) which is contacting the conductor tape on one or on both major surfaces in an electrically conducting manner such that the conductor tape (21) in its normal conducting state is electrically shunted by the mounting element (23) in the contact region.

Abstract: The invention relates to a switching element for modifying the electric resistance with at least one high temperature superconductor (1) and means (3) for irradiating electromagnetic high frequency onto the at least one high temperature superconductor (1). The invention further relates to a method for switching a high temperature superconductor (1) comprising the steps of providing a high temperature superconductor (1) in the superconducting state and irradiating an electromagnetic high frequency until the high temperature superconductor (1) changes over into a normally conducting state.

Abstract: The invention relates to an apparatus for the production of thin oxide coatings, having a vacuum chamber wherein an oxygen chamber with an opening and a rotary substrate holder overlapping the latter are disposed. For the rotary arrangement of the substrate holder a rotary mounting is provided, which engages a circumferential portion of the substrate holder.