Patents Assigned to Thin Film Technology Corp.
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Patent number: 7200010Abstract: A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.Type: GrantFiled: September 24, 2003Date of Patent: April 3, 2007Assignee: Thin Film Technology Corp.Inventors: Mark Hamilton Broman, Mike Howieson, Tsuguhiko Takamura, Mark Brooks, Yasutsugu Okamoto, Brent Huibregtse
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Patent number: 6828876Abstract: Thin film devices having conductors of non-uniform line width and line spacing between adjacent conductors at uncoupled regions of symmetrical conductive pathways. Several coil-shaped delay line circuits are disclosed wherein the innermost and outermost conductors exhibit different line width and spacing between adjoining conductors. The devices are constructed on rigid and flexible, folding substrates and necessary terminations are connected with solder filled vias and/or edge connections.Type: GrantFiled: November 2, 2001Date of Patent: December 7, 2004Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Hiroo Inoue
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Patent number: 6819569Abstract: A thin film circuit module for terminating circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein one of the capacitor plates defines a circuit resistor. The equalizer modules are serially coupled to trace conductors of a connector block. Another hybrid equalizer construction includes thin film resistors and pick-and-placed capacitors.Type: GrantFiled: December 6, 2002Date of Patent: November 16, 2004Assignee: Thin Film Technology Corp.Inventors: Mark Hamilton Broman, Mike Howieson, Brent Randel Huibregtse, Tsuguhiko Takamura
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Patent number: 6414250Abstract: Thin film, multi-layered components wherein the layers are hermetically sealed with a re-flowed conductive sealant (e.g. Pb/Sn solder). The sealant is applied to an endless ground conductor at the peripheral edge of at least one of each pair of opposed substrate layers prior to registering the conductors and re-flowing the sealant. The microstrip conductors comprise thin film adhesion and seed layers and a covering metalization. The signal and ground conductors are terminated with solder balls and the signal and ground conductors are connected with micro vias that extend through the substrates.Type: GrantFiled: December 30, 2000Date of Patent: July 2, 2002Assignee: Thin Film Technology Corp.Inventors: Hiroo Inoue, Michael Howieson, Mark Brooks
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Patent number: 6329890Abstract: Modular thin film, distributed, lumped element band-pass filters. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative band-pass filter and delay line circuits are disclosed that provide desirable delay characteristics. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements and/or provide a hermetic seal between the layers. The assemblies are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.Type: GrantFiled: September 29, 2000Date of Patent: December 11, 2001Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Mark Hamilton Broman
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Patent number: 6127906Abstract: A modular thin film, distributed, lumped element band-pass filter. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative 800 MHz and 1.9 GHz band-pass filter circuits are disclosed. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements. The layers are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.Type: GrantFiled: February 25, 1999Date of Patent: October 3, 2000Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Mark Hamilton Broman
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Patent number: 5815050Abstract: A thin film differential delay line configured in a strip line assembly on ceramic substrates for PECL logic applications. A number of alternative layered constructions are disclosed. Each assembly provides complementary serpentine conductors constructed in symmetrical arrangements, i.e. side-by-side, over-under and mirrored. Bordering ground conductors at the signal layer and adjacent ground planes layers shield the delay line conductors. Termination pads having plated through vias facilitate electrical couplings between the layers.Type: GrantFiled: December 27, 1996Date of Patent: September 29, 1998Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Mark Hamilton Broman, Michael Howieson
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Patent number: 5506754Abstract: Discrete circuit devices constructed on a component substrate thermally matched to the supporting substrate of a higher level circuit assembly. Upon securing each component to the supporting substrate of a higher level circuit assembly, a connection subject to reduced thermal stress is obtained. In the construction of an exemplary surface mount, hybrid component containing resistors and capacitors, a component substrate of a polyimide impregnated material is populated with a repeating matrix of chip capacitors and chip resistors, which are adhesively bound and soldered to selected termination pads containing high temperature solder filled through vias. The substrate is epoxy encapsulated and then diced at selected ones of the through vias into multiple components. Each thermally matched component is resoldered at the separated vias to obtain surface mount terminations. Portions of the vias may be exposed through the component sidewall to permit circuit test.Type: GrantFiled: June 29, 1994Date of Patent: April 9, 1996Assignee: Thin Film Technology Corp.Inventors: Mark Brooks, Gary Seibel