Abstract: A method for mechanically separating a laminar structure from a first carrier assembly, comprising or consisting of a first carrier, wherein the laminar structure comprises a wafer and a second, stretchable carrier is disclosed. Also disclosed are the use of a particular separating aid for separating a laminar structure and a device for carrying out the method.

Abstract: The present patent application relates to a wafer support arrangement, comprising a wafer (1), a support layer system (5, 6) and a separating layer (4), which is arranged between the support layer system (5, 6) and the wafer (1), wherein the support layer system (5, 6) (i) comprises a support layer (6) and (ii) a layer (5) from a through hardened, partially hardened or hardenable elastomer material on the separating layer side or consists of these two layers and wherein the separating layer (4) (iii) is a plasma polymer layer and (iv) the adhesive bond between the support layer system (5, 6) and the separating layer (4), after the elastomer material has through hardened, is greater than the adhesive bond between the wafer (1) and the separating layer (4).

Abstract: The invention relates to a method for bonding a first surface (1a) and a second surface (7a) by means of an interlayer (3), comprising the steps: a) providing a first item (1) which has the first surface (1a), b) providing flowable, solidifiable material for the interlayer (3), c) providing a second item (7) which has the second surface (7a), d) applying the material for the interlayer onto the first surface (1a) so that a bulge (3a) encircling the surface is produced, e) applying a vacuum around the first item (1) and the second item (2), f) bringing the second surface (7a) of the second item (7) into contact with the circumferential bulge so that a sealed-off cavity (5) is produced, g) increasing the ambient pressure so that the cavity (5) is eliminated without resulting in a stream of gas flowing into the cavity and h) increasing the viscosity of the material for the interlayer.

Abstract: A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.