Patents Assigned to THINFLEX CORPORATION
  • Opaque polyimide coverlay
    Publication number: 20040142191
    Abstract: The present invention relates to an opaque polyimide coverlay, which is made of a transparent protection coverfilm coating with black epoxy adhesive, wherein the opaque polyimide using a transparent and heat resistant polyimide film is used as a protection coverfilm instead of using a higher cost of black polyimide film and using a black epoxy adhesive comprising carbon black powder instead of using a common epoxy adhesive.
    Type: Application
    Filed: January 13, 2004
    Publication date: July 22, 2004
    Applicant: THINFLEX CORPORATION
    Inventors: Wang Mei-Yen, Huang Chuan-Yi, Jiang Ying-Teh