Patents Assigned to Thintronics, Inc.
  • Curable film composition, curable film, and cured product thereof
    Patent number: 11926736
    Abstract: A curable film and a cured product obtained by curing the curable film are disclosed. The curable film contains, as essential components, hollow glass microspheres and a rubber composition containing at least one diene-based rubber. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: March 12, 2024
    Assignee: Thintronics, Inc.
    Inventors: Stefan J. Pastine, Yaroslav Klichko
  • Materials for printed circuit boards
    Patent number: 11930596
    Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: March 12, 2024
    Assignee: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Curable film composition, curable film, and cured product thereof
    Patent number: 11926737
    Abstract: A composition for curable films, a curable film made thereof, and a cured product obtained by curing the curable film are disclosed. The curable film contains fused silica and/or hollow glass microspheres, a rubber composition containing at least one diene-based rubber, and a toluene soluble maleimide resin. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.
    Type: Grant
    Filed: February 24, 2023
    Date of Patent: March 12, 2024
    Assignee: Thintronics, Inc.
    Inventors: Stefan J. Pastine, Yaroslav Klichko
  • Polymer compositions and their uses
    Patent number: 11820875
    Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: November 21, 2023
    Assignee: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • MATERIALS FOR PRINTED CIRCUIT BOARDS
    Publication number: 20230309221
    Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
    Type: Application
    Filed: January 12, 2023
    Publication date: September 28, 2023
    Applicant: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Materials for printed circuit boards
    Patent number: 11596066
    Abstract: Described herein are dielectric polymer films and printed circuit boards, such as multilayer and high-density interconnect printed circuit board comprising at least one dielectric polymer film.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: February 28, 2023
    Assignee: Thintronics. Inc.
    Inventors: Tarun Amla, Stefan J. Pastine
  • Polymer compositions and their uses
    Patent number: 11359062
    Abstract: Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: June 14, 2022
    Assignee: Thintronics, Inc.
    Inventors: Tarun Amla, Stefan J. Pastine