Abstract: A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.: the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B); the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C. with respect to the whole of the component (B); and the component (C): an encapsulated epoxy adduct-type latent curing agent.

Abstract: An object of the present invention is to provide a curable resin composition capable of being quickly cured at a low temperature by irradiation of an active energy ray such as light and having excellent storage stability, and a curing method. Furthermore, in the curable resin composition of the present invention, which uses a component (D) in combination, the active energy ray curability is more improved.

Abstract: [Problem] An object of the present invention is to provide a sealant composition for a nonaqueous electrolyte cell in which the application position and uniformity of applied film thickness of the sealant can be visually confirmed even when being applied as a thin film, and having excellent durability in relation to various electrolytic solutions used in the cell. [Solution] A sealant composition for a nonaqueous electrolyte cell, containing (A) an elastomer and (B) a cobalt blue colorant, in which the component (B) has a content of 0.1-20 mass parts with respect to 100 mass parts of the component (A).

Abstract: [Problem] To provide a photocurable sealing material which exhibits stable physical properties, particularly permanent compression set when subjected to a heat resistance test in an atmosphere of 100 to 150° C., and has a stable applying shape and storage stability. [Solution] A photocurable composition containing components (A) to (C) mentioned below, in which the mass ratio of the component (A) to the component (B) is 3:7 to 8:2; component (A): a compound having a polymer of a (meth)acrylic monomer as a main skeleton and having one (meth)acryl group at each of the both terminals; component (B): a compound having a polymer of a (meth)acrylic monomer as a main skeleton and having one (meth)acryl group at only one terminal; and component (C): a photoinitiator.

Abstract: Conventionally, a photocurable resin can be used for forming a soft cured product but is difficult to have thick film curability and exhibit moisture resistance. A photocurable composition containing components (A) to (D), in which a ratio of a (meth)acrylate monomer having an aromatic group in the component (C) is 30 to 100%: the component (A): an isoprene polymer having a (meth)acrylic group, the component (B): an isoprene polymer having a hydroxyl group, the component (C): at least one kind of (meth)acrylate monomers selected from a (meth)acrylate monomer having an aromatic group and an alkyl (meth)acrylate monomer, and the component (D): a hydrogenated terpene resin.

Abstract: In the past, it was difficult to fix an adherend sufficiently during polishing processing and to peel off the adherend conveniently. Provided is a non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N.

Abstract: An object of the present invention is to provide a curable resin composition capable of being quickly cured at a low temperature by irradiation of an active energy ray such as light and having excellent storage stability, and a curing method. Furthermore, in the curable resin composition of the present invention, which uses a component (D) in combination, the active energy ray curability is more improved.

Abstract: A material pressure feeding apparatus 10 includes a container 12 for receiving a bag 11, in which a viscous material M is contained, a press member 13 exerting a pressing force on the material, a pressure feeder 15 pressure-feeding, to the outside, the material M sucked by the pressing force by the press member 13, and an annular member 16 positioned on the outer peripheral side of the press member 13. The press member 13 has a supporting space S on the outer peripheral side thereof, and a ring portion 40 constituting an annular member 16 is supported in the supporting space S in a relatively movable state. Thus, even when the press member 13 is inclined, the annular member 16 is configured so as not to form a clearance between it and the inner peripheral surface of the container 12 without any influence of the inclination.

Abstract: A photocurable resin composition for sealing an organic EL device is provided, which can seal the organic EL device without exerting any bad influence on the device, thereby suppress the formation and growth of dark spots positively, and which can ensure a high transmittance of light, thereby maintain a stable light emitting characteristic over a long period of time. The composition comprises (A) an epoxy resin containing at least two glycidyl groups in each molecule thereof and having a molecular weight of 200 to 7000, (B) an epoxy resin containing at least one glycidyl group in each molecule thereof and having a molecular weight of 20000 to 100000, (C) a latent acid photo catalyst adapted to be activated and produce an acid upon being irradiated with energy beam, and (D) a silane coupling agent containing a glycidyl group in each molecule thereof, the composition exhibiting non-fluidity at 25° C., but exhibiting fluidity in a temperature range of 50° to 100° C.

Abstract: The present invention provides a temporary fixing composition capable of fixing wafers and the like and metals with high adhesive strength and removing easily and completely the wafers and the like and the metals without breakage thereof. The temporary fixing composition used for flat surface polishing includes the following components (A) to (C): Component (A): a thermoplastic resin polymerized from an ?-olefin having 16 to 35 carbon atoms alone; Component (B): a hydrogenated tackifier; and Component (C): a hydrocarbon compound which is in the state of a solid at 25° C., and having a melt viscosity of 1 to 5000 mPa·s at 100° C. and a Shore D hardness of 30 to 100.

Abstract: The present invention relates to an aminimide compound having a structure represented by the following general formula (I) in the molecule thereof, relates to a curable composition using the aminimide compound and relates to a method for curing the composition; in which R0 represents a hydrogen atom, an alkyl group which may have an optional substituent, an aryl group which may have an optional substituent, or a heterocyclic residue which may have an optional substituent. R1, R2 and R3 each independently represent a hydrogen atom, or an optional substituent. However, at least two of R1, R2 and R3 may bond to each other to form a cyclic structure.

Abstract: [Problem] To provide a photocurable sealing material which exhibits stable physical properties, particularly permanent compression set when subjected to a heat resistance test in an atmosphere of 100 to 150° C., and has a stable applying shape and storage stability. [Solution] A photocurable composition containing components (A) to (C) mentioned below, in which the mass ratio of the component (A) to the component (B) is 3:7 to 8:2; component (A): a compound having a polymer of a (meth)acrylic monomer as a main skeleton and having one (meth)acryl group at each of the both terminals; component (B): a compound having a polymer of a (meth)acrylic monomer as a main skeleton and having one (meth)acryl group at only one terminal; and component (C): a photoinitiator.

Abstract: An aqueous coating composition having excellent coating adhesion, workability, heat resistance and chemical resistance, and has an object to provide an aqueous coating composition for sealing, which is suitable for members to be screwed in. An aqueous coating composition including: as main components, component (A) an ethylene-vinyl acetate copolymer resin emulsion and component (B) two or more PTFE resin powders having different particle diameters, in which 35 to 80 parts by mass of water is contained on the basis of 100 parts by mass of the total of (A) and (B).

Abstract: The present invention allows for a photocurable composition which exhibits stable physical characteristics in a heat resistance test and an oil resistance test, and exhibits good debubbling properties and excellent workability. A photocurable composition including components (A) to (C). component (A): a compound that has a polymer obtained from a (meth)acrylic monomer as a main skeleton, and has at least two (meth)acrylic groups in the molecule component (B): a (meth)acrylic monomer including a component (b-1) and/or a component (b-2) component (b-1): a (meth)acrylic monomer having a hydroxyl group in the molecule, in an amount of 0.1 to 50 parts by mass with respect to 100 parts by mass of the component (A), component (b-2): a (meth)acrylic monomer having a saturated alicyclic skeleton in the molecule, in an amount of 0.

Abstract: A curable sheet composition able to follow up a mold shape under the application of heat and pressure, able to polymerize and cure upon being irradiated with light, permitting an optical element molding pattern to be fixed, and comprising 50% to 94% of a polycarbonate diol-modified urethane acrylate oligomer, 5% to 40% of a (meth)acrylate containing at least one carboxyl group in each molecule thereof, and 0.5% to 5% of a photopolymerization initiator.

Abstract: A material pressure feeding apparatus 10 includes a container 12 for receiving a bag 11, in which a viscous material M is contained, a press member 13 exerting a pressing force on the material, a pressure feeder 15 pressure-feeding, to the outside, the material M sucked by the pressing force by the press member 13, and an annular member 16 positioned on the outer peripheral side of the press member 13. The press member 13 has a supporting space S on the outer peripheral side thereof, and a ring portion 40 constituting an annular member 16 is supported in the supporting space S in a relatively movable state. Thus, even when the press member 13 is inclined, the annular member 16 is configured so as not to form a clearance between it and the inner peripheral surface of the container 12 without any influence of the inclination.

Abstract: The present invention relates to a photocurable silicone gel composition includes: (A) an organopolysiloxane having at least one group represented by the following general formula (1): in which R1 and R2 each represent hydrogen or an alkyl group having a carbon number of 1 to 20, in an amount of 100 parts by mass; (B) a mercaptoalkyl group-containing organopolysiloxane in an amount of parts by mass such that the number of moles of the mercaptoalkyl group is 0.01 to 1.0 mole per 1 mole of the group represented by the general formula (1) in the component (A); (C) a photopolymerization initiator in an amount of 0.01 to 20 parts by mass per 100 parts by mass of the component (A); and (D) a hindered amine compound having a group represented by the following general formula (2): in which R3 to R6 each represent hydrogen or an alkyl group having a carbon number of 1 to 20, and R7 represents hydrogen or —CH2—R8 in which R8 represents hydrogen or a monovalent organic group, in an amount of 0.

Abstract: The present invention relates to a curable composition including: (a) at least one compound having at least one (meth)acrylic functional group in the molecule thereof, which is selected from a (meth)acrylic monomer and a (meth)acrylic oligomer; (b) an organic peroxide; (c) an o-benzoic sulfimide; and (d) an oxazoline compound, in which the component (d) is contained in an amount of 0.005 to 10 parts by mass based on 100 parts by weight of the component (a).

Abstract: In the past, it was difficult to fix an adherend sufficiently during polishing processing and to peel off the adherend conveniently. Provided is a non-reactive temporary fixing composition for plane polishing having a shear strength of not less than 0.05 MPa and a peeling strength of less than 100 N.

Abstract: The present invention relates to an aminimide compound having a structure represented by the following general formula (I) in the molecule thereof, relates to a curable composition using the aminimide compound and relates to a method for curing the composition; in which R0 represents a hydrogen atom, an alkyl group which may have an optional substituent, an aryl group which may have an optional substituent, or a heterocyclic residue which may have an optional substituent. R1, R2 and R3 each independently represent a hydrogen atom, or an optional substituent. However, at least two of R1, R2 and R3 may bond to each other to form a cyclic structure.