Patents Assigned to THREE STONE, LLC.
  • Patent number: 12402727
    Abstract: A multilayer blow-molded board comprises an upper layer board and a lower layer board to form a hollow structure. Each of the layer boards comprises an outer layer and an inner layer. The present disclosure has the following advantages: the lower layer board is recessed upward so that the inner layers of the board and the upper layer board fuse with each other to form a supporting contact structure, resulting in enhanced structure strength. Furthermore, the outer layer of the board can utilize a strong surface-strength material whereas the inner layer can utilize a low thermoplastic-shrinkage-rate material to provide a frame support. In addition, a tough and flexible material is adopted for the intermediate layer to improve the overall structural strength of the blow-molded board.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 2, 2025
    Assignee: THREE STONE, LLC.
    Inventors: Yixiang Jiang, Jinglei Jiang
  • Publication number: 20210022502
    Abstract: A multilayer blow-molded board comprises an upper layer board and a lower layer board that are blow-molded to form a hollow structure. Each of the upper layer board and the lower layer board comprises an outer layer and an inner layer. The lower layer board is recessed upward so that the inner layers of the lower layer board and the upper layer board fuse with each other to form a supporting contact structure.
    Type: Application
    Filed: October 31, 2019
    Publication date: January 28, 2021
    Applicant: THREE STONE, LLC.
    Inventors: Yixiang JIANG, Jinglei JIANG