Abstract: A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 ?m, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 ?m, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).

Abstract: Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

Abstract: The present invention relates to a curable composition including: (a) at least one compound having at least one (meth)acrylic functional group in the molecule thereof, which is selected from a (meth)acrylic monomer and a (meth)acrylic oligomer; (b) an organic peroxide; (c) an o-benzoic sulfimide; and (d) an oxazoline compound, in which the component (d) is contained in an amount of 0.005 to 10 parts by mass based on 100 parts by weight of the component (a).

Abstract: A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 ?m, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 ?m, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).

Abstract: The coating layer has excellent water repellency and satisfactory gloss to a base material and provides a method for forming a coating layer in which the agents used have, for example, excellent storage stability and dispersibility. The coating layer has a layer (I) formed by curing a film-forming agent containing predetermined amounts of a polyorganosiloxane having at least one hydrolyzable functional group in its molecule, a curing catalyst, and an organic solvent including a saturated hydrocarbon solvent and an aromatic hydrocarbon solvent each having 8 to 15 carbon atoms at a predetermined ratio and a layer (II) formed by solidifying a finish treatment agent containing predetermined amounts of a polyorganosiloxane having at least one pendant amino group, a polyorganosiloxane having two or more terminal amino groups, a silicone resin emulsion emulsified with a nonionic or anionic surfactant, a hydrophilic group-containing organic solvent, and water.

Abstract: The present invention relates to a photocurable silicone gel composition includes: (A) an organopolysiloxane having at least one group represented by the following general formula (1): in which R1 and R2 each represent hydrogen or an alkyl group having a carbon number of 1 to 20, in an amount of 100 parts by mass; (B) a mercaptoalkyl group-containing organopolysiloxane in an amount of parts by mass such that the number of moles of the mercaptoalkyl group is 0.01 to 1.0 mole per 1 mole of the group represented by the general formula (1) in the component (A); (C) a photopolymerization initiator in an amount of 0.01 to 20 parts by mass per 100 parts by mass of the component (A); and (D) a hindered amine compound having a group represented by the following general formula (2): in which R3 to R6 each represent hydrogen or an alkyl group having a carbon number of 1 to 20, and R7 represents hydrogen or —CH2—R8 in which R8 represents hydrogen or a monovalent organic group, in an amount of 0.

Abstract: The present invention provides a curable resin composition for coating natural or artificial nails, which in particular exhibits an excellent appearance after coating, high water and scratch resistances, and low levels of odor, damage to nails, and dermal irritancy, resulting in a high level of safety to human bodies and superior storage stability. The curable resin composition for coating a natural or artificial nail of the present invention comprises (A) an aqueous emulsion of a polymer having functional groups polymerizable by exposure to active energy radiation, (B) polyethylene glycol, and (C) a photo radical initiator containing no nitrogen atom in its molecule.