Patents Assigned to TI Automative Technology Center GmbH
  • Publication number: 20110140314
    Abstract: A method of connecting a component to a molded article may include disposing a component adjacent to a wall of the article being molded, overlapping a portion of the component with a portion of the wall of the article being molded while the wall is still at least partially molten, and permitting the wall of the article being molded to cool with said portion of the component still overlapped by the wall. Preferably, a portion of the component is overlapped on two sides by the wall of the article being molded to firmly retain the component relative to the article after the article is formed. The article may be a receptacle, or any other object, as desired.
    Type: Application
    Filed: December 9, 2010
    Publication date: June 16, 2011
    Applicant: TI Automative Technology Center GmbH
    Inventor: Peter Grauer