Patents Assigned to TIBC Co., Ltd.
  • Lead pin for mounting semiconductor and printed wiring board
    Patent number: 7723620
    Abstract: A semiconductor loading lead pin that does not tilt at a time of reflow. A void is sometimes left in solder between an electrode pad and the flange of a semiconductor loading lead pin. When reflow is carried out to load an IC chip, the solder for connection is melted and at the same time, the void in the solder is expanded. The solder escapes sideway along the groove portion, and thereby a flange is not raised by the void so that the semiconductor loading lead pin is not tilted.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: May 25, 2010
    Assignees: IBIDEN Co., Ltd., TIBC Co., Ltd.
    Inventors: Masanori Kawade, Hiroyuki Tsuruga, Makoto Ebina