Patents Assigned to Ticona LLC
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Patent number: 12018129Abstract: Methods and systems are provided for recovering an organic solvent from a waste sludge generated during formation of a polyarylene sulfide. Methods include combining the waste sludge with a liquid extractant that extracts the organic solvent into a homogeneous liquid phase. Upon a temperature change, the homogeneous liquid phase can separate into an organic solvent-rich liquid phase and a liquid extractant-rich liquid phase. The two liquid phases can be separated and further processed if desired to further purify the recovered organic solvent. Methods can also include forming the polyarylene sulfide by a polymerization process and thereafter purifying a slurry of the polyarylene sulfide. A liquid washing product is formed as a result of the purification process, which can be subjected to a distillation process that forms an organic solvent-rich stream and the waste sludge.Type: GrantFiled: September 6, 2022Date of Patent: June 25, 2024Assignee: Ticona LLCInventors: Hendrich A. Chiong, Venkata M. Nekkanti
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Patent number: 12012503Abstract: A polymer composition containing cellulose acetate in combination with one or more impact modifiers is described. The polymer composition can also contain a plasticizer and a bio-based polymer in addition to the cellulose acetate. The polymer composition is formulated so as to have properties similar to petroleum-based polymers for producing, for example, single-use biodegradable articles.Type: GrantFiled: December 10, 2020Date of Patent: June 18, 2024Assignee: TICONA LLC.Inventors: Christopher McGrady, Rongfu Li, Michael Combs, Xiaowei Zhang, Suresh Subramonian
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Patent number: 11939467Abstract: Polyoxymethylene polymer compositions and molded articles made from the composition are disclosed that are fuel resistant, particularly diesel fuel resistant, and resistant to highly acidic solutions. The polymer composition contains a polyoxymethylene polymer generally in an amount from about 90% to about 95% by weight. In addition, the polymer composition contains an acid neutralizing agent and a plasticizer at a weight ratio that has been found to significantly improve the acid resistant properties of the composition.Type: GrantFiled: July 7, 2022Date of Patent: March 26, 2024Assignee: Ticona LLCInventors: Sung Hye Kim, Rong Luo, Katrina Czenkusch
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Patent number: 11939464Abstract: A polyoxymethylene polymer composition is disclosed containing a formaldehyde stabilizer package. The formaldehyde stabilizer package, which contains at least two emission control agents, dramatically and unexpectedly reduces formaldehyde emissions. The formaldehyde stabilizer package includes at least two emission control agents selected from the group of benzoguanamine compounds, a hydantoin, a substituted hydantoin, an amino acid, and an alkylene urea such as ethylene urea.Type: GrantFiled: July 1, 2022Date of Patent: March 26, 2024Assignee: TICONA LLCInventors: Sung Hye Kim, Rong Luo, Jared T. Kindt
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Patent number: 11931973Abstract: A fiber-reinforced polymer composition that comprises a polymer matrix that contains a propylene polymer is provided. The polymer matrix constitutes from about 20 wt. % to about 90 wt. % of the composition, and the composition further comprises a plurality of long reinforcing fibers that are distributed within the polymer matrix, wherein the fibers constitute from about 10 wt. % to about 60 wt. % of the composition. Further, the composition also comprises a stabilizer system comprising a sterically hindered phenol antioxidant, phosphite antioxidant, and thioester antioxidant.Type: GrantFiled: February 19, 2019Date of Patent: March 19, 2024Assignee: Ticona LLCInventors: Aaron H. Johnson, Darin Grinsteinner
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Patent number: 11919273Abstract: A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.Type: GrantFiled: July 11, 2022Date of Patent: March 5, 2024Assignee: Ticona LLCInventors: Junchen Ding, Yanjun Li, Rong Luo
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Patent number: 11917753Abstract: A laminate for use in a circuit board is provided. The laminate comprises a conductive layer and a film positioned adjacent to the conductive layer. The film comprises a polymer composition that includes a liquid crystalline polymer and a hydrophobic material. The polymer composition exhibits a dielectric constant of about 5 or less and dissipation factor of about 0.05 or less at a frequency of 10 GHz.Type: GrantFiled: August 18, 2020Date of Patent: February 27, 2024Assignee: Ticona LLCInventors: Xiaowei Zhang, Xinyu Zhao, Christopher McGrady
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Patent number: 11912817Abstract: A laser activatable polymer composition is provided. The composition contains at least one laser activatable additive and at least one high naphthenic thermotropic liquid crystalline polymer that contains repeating units derived from naphthenic hydroxycarboxylic and/or dicarboxylic acids in an amount of about 10 mol. % or more. The polymer composition exhibits a dielectric constant of about 5 or less as determined at a frequency of 2 GHz.Type: GrantFiled: August 18, 2020Date of Patent: February 27, 2024Assignee: Ticona LLCInventors: Young Shin Kim, Xiaowei Zhang
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Patent number: 11884795Abstract: A compact camera module that contains a generally planar base on which is mounted a lens barrel is provided. The base, barrel, or both are molded from a polymer composition that includes a thermotropic liquid crystalline polymer and a plurality of mineral fibers (also known as “whisker”). The mineral fibers have a median width of from about 1 to about 35 micrometers and constitute from about 5 wt. % to about 60 wt. % of the polymer composition.Type: GrantFiled: September 30, 2021Date of Patent: January 30, 2024Assignee: Ticona LLCInventor: Young Shin Kim
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Patent number: 11879047Abstract: Disclosed are porous elements that include sintered polymeric particles. The polymeric particles can be formed of a thermoplastic composition that includes a polyarylene sulfide. The polymeric particles sintered to form the porous elements have a very narrow size distribution. The porous elements can maintain their functionality and morphology even when utilized in high temperature applications.Type: GrantFiled: December 3, 2021Date of Patent: January 23, 2024Assignee: Ticona LLCInventors: Erman Senoz, Dian Chen, Christopher McGrady, Jun Luo, Rong Luo
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Patent number: 11851561Abstract: A fiber-reinforced polymer composition a plurality of continuous fibers embedded and distributed within a thermoplastic polymer matrix is provided. The thermoplastic polymer matrix constitutes from about 20 wt. % to about 90 wt. % of the composition and the continuous fibers constitute from about 10 wt. % to about 80 wt. % of the composition. Further, the polymer composition has a deflection temperature under load of about 60° C. or more as determined in accordance with ISO 75:2013 at a load of 3.5 MPa.Type: GrantFiled: June 14, 2021Date of Patent: December 26, 2023Assignee: Ticona LLCInventors: David W. Eastep, Kent Moore
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Patent number: 11827772Abstract: A polymer composition containing cellulose acetate in combination with one or more bloom resistant or bio-based plasticizers and optionally one or more bio-based polymers is described. The polymer composition is formulated so as to have properties similar to petroleum-based polymers for producing, for example, single-use biodegradable articles.Type: GrantFiled: December 10, 2020Date of Patent: November 28, 2023Assignee: Ticona LLCInventors: Christopher McGrady, Rongfu Li, Michael Combs, Xiaowei Zhang, Suresh Subramonian
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Patent number: 11820892Abstract: A polymer composition that is capable of exhibiting a unique combination of ductility (e.g., tensile elongation at break), impact strength (e.g., Charpy notched impact strength), and dimensional stability is provided. For example, the polymer composition may contain a liquid crystalline polymer in combination with an epoxy-functionalized olefin copolymer and an inorganic particulate material.Type: GrantFiled: December 21, 2021Date of Patent: November 21, 2023Assignee: Ticona LLCInventor: Young Shin Kim
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Patent number: 11732120Abstract: A fiber-reinforced polymer composition that contains a polymer matrix, stabilizer system, and a plurality of long reinforcing fibers that are distributed within the polymer matrix is provided. The stabilizer system comprises an antioxidant, an ultraviolet light stabilizer, and a carbon material that includes carbon particles. The polymer composition defines a surface that exhibits a ?E value of from about 0.6 to about 3 after being exposed to UV light at a total exposure level of 2,500 kJ/m2 according to SAE J2527_2017092.Type: GrantFiled: December 3, 2021Date of Patent: August 22, 2023Assignee: Ticona LLCInventor: Aaron H. Johnson
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Patent number: 11729908Abstract: A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.Type: GrantFiled: February 18, 2021Date of Patent: August 15, 2023Assignee: Ticona LLCInventor: Young Shin Kim
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Patent number: 11725105Abstract: A polymer composition comprising a polymer matrix within which a plurality of flake-shaped mineral particles and mineral whiskers are distributed is provided. The polymer composition exhibits an in-plane thermal conductivity of about 0.2 W/m-K or more as determined in accordance with ASTM E 1461-13.Type: GrantFiled: July 14, 2021Date of Patent: August 15, 2023Assignee: Ticona LLCInventor: Young Shin Kim
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Patent number: 11725106Abstract: A polymer composition that contains an aromatic polymer in combination with a tribological formulation is provided. The polymer composition may exhibit a low degree of surface friction that minimizes the extent to which a skin layer is peeled off during use of a part containing the composition (e.g., in a camera module). For example, the polymer composition may exhibit a dynamic coefficient of friction of about 1.0 or less and/or a wear depth may be about 500 micrometers or less as determined in accordance with VDA 230-206:2007.Type: GrantFiled: November 9, 2020Date of Patent: August 15, 2023Assignee: Ticona LLCInventor: Young Shin Kim
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Patent number: 11728065Abstract: A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.Type: GrantFiled: July 13, 2021Date of Patent: August 15, 2023Assignee: Ticona LLCInventor: Young Shin Kim
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Patent number: 11725095Abstract: A compact camera module that contains a generally planar base on which is mounted a lens barrel is provided. The base, barrel, or both are molded from a polymer composition that includes a thermotropic liquid crystalline polymer and a plurality of mineral fibers (also known as “whisker”). The mineral fibers have a median width of from about 1 to about 35 micrometers and constitute from about 5 wt. % to about 60 wt. % of the polymer composition.Type: GrantFiled: March 1, 2021Date of Patent: August 15, 2023Assignee: Ticona LLCInventor: Young Shin Kim
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Patent number: 11728559Abstract: A polymer composition comprising a semiconductive material distributed within a polymer matrix is provided. The semiconductive material includes inorganic particles and an electrically conductive material, the inorganic particles having an average particle size of from about 0.1 to about 100 ?m and an electrical conductivity about 500 ?S/cm or less. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection under load of about 40° C. or more. The polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.Type: GrantFiled: February 18, 2021Date of Patent: August 15, 2023Assignee: Ticona LLCInventor: Young Shin Kim