Patents Assigned to TIEHAN GE
  • Patent number: 10066791
    Abstract: A spiral LED packaging filament comprises a substrate, a plurality of LED chips disposed on the top surface of the substrate, a medium layer sealing the plurality of LED chips and the top surfaces of the substrate into a sealed LED package; two electrode wires being electric connected to the plurality of LED chips, wherein the sealed LED package has a spiral shape. A light bulb with the spiral LED packaging filament comprises a bulb shell; a stem having a supporting pole, an electrical wire and a stem exhaust pipe, at least one spiral LED packaging filament is fixed on the stem; the electrode wire is connected to the electrical connector via the drive; and the bulb shell and the stem are respectively sealed.
    Type: Grant
    Filed: November 27, 2014
    Date of Patent: September 4, 2018
    Assignee: TIEHAN GE
    Inventor: Tiehan Ge