Patents Assigned to Tii Technologies Inc.
  • Patent number: 10180554
    Abstract: A track system for routing an optical fiber includes a track for selectively retaining the optical fiber therein, a cover piece which is mounted to the track, and a corner piece which is mounted to the track. The track is formed as an elongated member and includes a pair of legs that are spaced apart from each other to define a slot and an internal channel into which the optical fiber is received. The cover piece is mountable to the track to help retain the optical fiber in the track.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: January 15, 2019
    Assignee: Tii Technologies Inc.
    Inventors: Jean-Claude Marcou, Vincent Barbo, David E. Foley, Walter Fay, Alex Clifton Feezer, Parag Mehta
  • Patent number: 10090609
    Abstract: A grounding module for telecommunication systems is mountable to an AC wall outlet and includes two cable connectors to which signal carrying cables are attached. The grounding module includes a housing having a main ground contact to provide a ground to an external electronic device connected thereto. An external grounding lug is mounted on one of the cable connectors to provide a separate ground connection to the metallic sleeves of the cable connectors. At least one of a surge protection circuit and ground protection circuit is provided and which is in electrical communication with the main ground contact. The grounding lug and metallic sleeves of the cable connectors are selectively electrically isolatable from the main ground contact.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: October 2, 2018
    Assignee: Tii Technologies Inc.
    Inventors: David E. Foley, Walter Fay
  • Patent number: 9312652
    Abstract: A switchable modular jack assembly includes a housing which defines a receptacle for receiving an RJ14 modular plug, and a socket for receiving a pre-wired adapter plug. Each of the RJ14 modular plug and the adapter plug has electrical contacts on an exposed surface thereof. The jack assembly also includes leaf spring electrical contacts which extend into the receptacle and socket. When no RJ14 modular plug is received by the receptacle, the leaf spring electrical contacts contact the electrical contacts of the adapter plug. When an RJ14 modular plug is received by the receptacle, the leaf spring electrical contacts contact the electrical contacts of the RJ14 modular plug, but not the electrical contacts of the adapter plug.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: April 12, 2016
    Assignee: Tii Technologies Inc.
    Inventors: Thomas J. Smith, Raymond Pepe
  • Publication number: 20140273649
    Abstract: A switchable modular jack assembly includes a housing which defines a receptacle for receiving an RJ14 modular plug, and a socket for receiving a pre-wired adapter plug. Each of the RJ14 modular plug and the adapter plug has electrical contacts on an exposed surface thereof. The jack assembly also includes leaf spring electrical contacts which extend into the receptacle and socket. When no RJ14 modular plug is received by the receptacle, the leaf spring electrical contacts contact the electrical contacts of the adapter plug. When an RJ14 modular plug is received by the receptacle, the leaf spring electrical contacts contact the electrical contacts of the RJ14 modular plug, but not the electrical contacts of the adapter plug.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Tii Technologies Inc.
    Inventors: Thomas J. Smith, Raymond Pepe