Abstract: A universal phone mounting apparatus is presented. The invention includes an elongate main body with an opening each end for access to a first and second axial cavities inside the main body. A first clamp with a first main rail slidably coupled in the first axial cavity through the first opening and a second clamp with a second main rail slidably coupled in the second axial cavity through the second opening. A compression spring may be located in either or both of the first and second cavities. On the side of the main body is a first port for selectively applying compressive force to the first main rail thereby restricting its movement, and a second port for selectively applying compressive force to the second main rail thereby restricting its movement. The main body further includes a channel on a bottom side for securely coupling an external mounting adapter.