Abstract: According to this process for inclusion of a thin electronic label (1) with a flat face, at a predetermined depth in the wall of a molded item made of plastic material (15) at a predetermined temperature and pressure, the flat face of the label (1) is first attached to a support (5) made of a plastic material, with a thickness essentially equal to the desired inclusion depth, the support (5) is attached to the wall (13) of the mold, then the plastic molding material (15) is brought into the mold (13, 14) at said pressure and temperature so that an intimate bond is formed by melting in the region of contact (8, 9, 10, 16) between the two plastic materials at the time of molding.