Patents Assigned to Toadenka Corporation
  • Patent number: 9683304
    Abstract: Disclosed is a resin-metal bonded body of an aluminum metal member and a thermoplastic resin member, which has improved bonding strength and good durability. Also disclosed is a method for producing such a resin-metal bonded body. Specifically disclosed is a resin-metal bonded body which is obtained by bonding an aluminum metal member with a thermoplastic resin member. In this resin-metal bonded body, the aluminum metal member and the thermoplastic resin member are bonded together by an anodic oxide coating having a film thickness of 70-1500 nm or an anodic oxide coating having a triazine thiol in the inner and upper portions. The anodic oxide coating has an infrared absorption spectrum peak intensity ascribed to OH group at 0.0001-0.16.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: June 20, 2017
    Assignee: Toadenka Corporation
    Inventors: Masumi Kuroyama, Tomonori Ishikawa, Kazuo Kato, Yaeko Sasaki, Shuhei Miura, Masayuki Nakamura, Setsuko Sato
  • Publication number: 20140102908
    Abstract: Disclosed is a resin-metal bonded body of an aluminum metal member and a thermoplastic resin member, which has improved bonding strength and good durability. Also disclosed is a method for producing such a resin-metal bonded body. Specifically disclosed is a resin-metal bonded body which is obtained by bonding an aluminum metal member with a thermoplastic resin member. In this resin-metal bonded body, the aluminum metal member and the thermoplastic resin member are bonded together by an anodic oxide coating having a film thickness of 70-1500 nm or an anodic oxide coating having a triazine thiol in the inner and upper portions. The anodic oxide coating has an infrared absorption spectrum peak intensity ascribed to OH group at 0.0001-0.16.
    Type: Application
    Filed: December 18, 2013
    Publication date: April 17, 2014
    Applicant: TOADENKA CORPORATION
    Inventors: Masumi KUROYAMA, Tomonori ISHIKAWA, Kazuo KATO, Yaeko SASAKI, Shuhei MIURA, Masayuki NAKAMURA, Setsuko SATO
  • Patent number: 8394503
    Abstract: Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10%?Cu2O/(Cu2O+CuO)?75%. Preferably, this resin-metal bonded article further contains a triazine thiol derivative in the resin-component-side bonding surface of the copper component.
    Type: Grant
    Filed: December 15, 2008
    Date of Patent: March 12, 2013
    Assignee: Toadenka Corporation
    Inventors: Masumi Kuroyama, Kazuo Kato, Tomonori Ishikawa, Yaeko Sasaki, Setsuko Sato, Masayuki Nakamura, Shuhei Miura
  • Publication number: 20110033711
    Abstract: Disclosed is a resin-metal bonded article which is improved in adhesion between a copper component and a PPS or PBT resin. Also disclosed is a method for producing such a resin-metal bonded article. The resin-metal bonded article is obtained by bonding the resin component onto the surface of the copper component through a copper component bonding surface where there is copper oxide in the following range: 10%?Cu2O/(Cu2O+CuO)?75%. Preferably, this resin-metal bonded article further contains a triazine thiol derivative in the resin-component-side bonding surface of the copper component.
    Type: Application
    Filed: December 15, 2008
    Publication date: February 10, 2011
    Applicants: Denso Corporation, Toadenka Corporation
    Inventors: Masumi Kuroyama, Kazuo Kato, Tomonori Ishikawa, Yaeko Sasaki, Setsuko Sato, Masayuki Nakamura, Shuhei Miura