Abstract: An apparatus which provides selectively either constant power, constant current or constant voltage to the heating elements of the thermods. The soldering system power supply apparatus includes devices for monitoring and controlling individual temperature profiles of each soldering thermod heating element. A computerized arrangement controls the power to each thermod in a very accurate manner. For the purpose of adjusting the power to each thermod element as a function of its temperature and the desired temperature profile, a set of temperature sensors are coupled to each of the thermod elements for measuring its temperature. Similarly, a set of energy sensors are also coupled to each of the thermod elements for detecting the amount of electrical energy supplied to each thermod.

Abstract: A tool changing system having high current surface mount tools, such as a hot bar reflow soldering head. The tool changing system includes a mounting fixture for connecting and disconnecting the surface mounting tool to a robotic unit. A low profile, small diameter robotic tool adaptor is utilized for coupling a variety of different types and kinds of robotic units to the surface mount tool and to reduce lead to pad misalignment problem caused by non-copolanarity between the mounting surface of the robotic unit and the working surface of the surface mount tool.

Abstract: A robotic controlled soldering apparatus is more precise in operation apparatus, and includes a protuberance and complementary shaped socket for defining a universal joint to provide a gimballing action to help prevent unwanted shift in the robotic control unit. A supply of fluid under pressure is directed between the pertuberance and the socket to reduce friction between their respective surfaces to reduce reaction on the delicate robotic arm as the head settles in place.

Abstract: A chip removal method and apparatus for use with a robotic unit. The chip removal apparatus includes a heated center quill and a soldering unit which cooperate together with a chip removal tool for simultaneously disabling the bonding materials securing a chip to a printed circuit board. The method permits the fine pitch chip device to be removed from the printed circuit board substantially intact for subsequent testing purposes.

Abstract: A fluxless reflow soldering processing and system having a reactive inert gas control arrangement coupled to a conventional reflow soldering head for enabling solder to wet metallic surfaces for joining purposes. The gas control arrangement includes a set of gas regulating valves and heat exchange units for supplying selected quantities of inert gases under pressure at various temperatures to a soldering area during the soldering process. The inert gases are employed to clean the soldering area of metal oxides and are used to facilitate the forming of a reliable solder joint by inhibiting the formation of metal oxides and by helping to cool down the solder joint in a substantially uniform manner.