Abstract: Proposed is an electric wire array including: a substrate portion; and a plurality of electric line units being arranged on top of the substrate portion and being stacked on top of each other in a thickness direction, wherein the plurality of electric wire units each comprise: a plurality of electric wires being arranged on top of the substrate portion in such a manner to extend in a length direction; and a plurality of electrode holes being positioned in respective first end portions, respectively, of the plurality of electric wires, and being exposed, wherein the plurality of electrode holes are arranged in such a manner as to be positioned a distance apart from each other along the length direction and being sequentially arranged in a successive manner along the thickness direction, and wherein the thickness direction is a direction from the substrate portion to the electric wire unit, and the length direction is a direction vertical to the thickness direction.

Abstract: A cochlear external device with an external microphone according to an embodiment of the present disclosure may include an external device body attached to a side of the head of a user, an internal microphone embedded in the external device body to collect sound, an external microphone located at the outside of the external device body to be attached around the ear of the user to collect sound, a connection cable configured to connect the external microphone and the external device body in a wired manner; and a control unit embedded in the external device body to generate an output signal based on the sound collected by at least one of the internal microphone and the external microphone and transmit the generated output signal to a cochlear implant transplanter.

Abstract: The embodiment discloses an electrode array including a housing; a plurality of first contact electrodes exposed to an outside of the housing; a plurality of second contact electrodes exposed to the outside of the housing; a first wire group disposed inside the housing and electrically connected to the first contact electrodes; and a second wire group disposed inside the housing and electrically connected to the second contact electrodes, the plurality of first contact electrodes and the first wire group being disposed on different planes within the housing.

Abstract: There is disclosed a human body implant device including a first unit including a transmission unit, and a second unit configured to communicate with the first unit, wherein the second unit includes a second package including a reception unit configured to receive power or an electrical signal from the transmission unit, a first package configured to generate a stimulation signal in response to the electrical signal, a connector configured to electrically connect the first package and the second package, and a cover configured to package the first package, the second package, and the connector.

Abstract: A method for manufacturing a liquid crystal polymer-based electrode array for a neural implant, according to the present invention, can comprise the steps of: forming a seed layer on a liquid crystal polymer substrate; forming a plating mold having a pattern selectively exposing a part of the upper part of the seed layer; plating an electrode material on the exposed seed layer by using the plating mold as a plating barrier layer; forming an electrode by removing the plating mold and the seed layer therebelow; embedding the electrode by compressing a liquid crystal polymer cover layer on the electrode; and forming an electrode site exposing the upper part of the electrode by selectively removing a part of the liquid crystal polymer cover layer.

Abstract: A method for manufacturing a liquid crystal polymer-based electrode array for a neural implant, according to the present invention, can comprise the steps of: forming a seed layer on a liquid crystal polymer substrate; forming a plating mold having a pattern selectively exposing a part of the upper part of the seed layer; plating an electrode material on the exposed seed layer by using the plating mold as a plating barrier layer; forming an electrode by removing the plating mold and the seed layer therebelow; embedding the electrode by compressing a liquid crystal polymer cover layer on the electrode; and forming an electrode site exposing the upper part of the electrode by selectively removing a part of the liquid crystal polymer cover layer.