Abstract: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.
Abstract: A method of regenerating a polishing pad for polishing semiconductor wafers is described wherein the polishing pad is removably stacked, aligned and fixed by a fitting ring to a polishing pad supporting surface of a polishing pad sub plate mounted on a central surface of a sub plate main body on an upper surface of a polisher rotation table and wherein the regeneration may include dressing, as well as cleaning, or regrooving the polishing pad surface.
Abstract: A method for use of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered, makes possible the convenient, effective and practical regeneration of polishing pads using a reforming tool.
Abstract: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.
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