Patents Assigned to Tohru Hara
  • Semiconductor integrated circuit and a method for forming the same
    Publication number: 20040211673
    Abstract: A plating solution containing 10 to 40 wt % of copper hexafluorosilicate. With the use of this plating solution, a copper thin film which has a low film stress and a low resistivity and which strongly (111)-oriented is plating-deposited on the fine pattern portion a copper seed layer, and film peeling caused by deterioration of an adhesion force between an underlying barrier layer and a copper seed layer even in a heat treatment process and in a chemical mechanical polishing (CMP) process after plating deposition is prevented.
    Type: Application
    Filed: May 21, 2004
    Publication date: October 28, 2004
    Applicants: Morita Chemical Industries Co., Ltd., Tohru Hara
    Inventors: Tohru Hara, Shoichi Ishida, Mitsuo Miyamoto, Tetsuo Yonezawa