Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Abstract: A resin composition for an optical waveguide is provided, which comprises: an epoxy compound represented by the following general formula (1): wherein m is 0 or a positive integer, n is 0 or a positive integer, R and R? which may be the same or different are each represented by the following formula (2) or (3), wherein c is a positive integer of 1 to 3 and each one of c may be the same or different, and X is represented by the following formula (4): wherein a is an integer of 0 to 2, and b is a positive integer of 1 to 3, and satisfy a condition of a+b=3, and a is 1 to 3 in the epoxy compound represented by the formula (1); and a photoacid generator. The resin composition has a lower viscosity, and is excellent in flexibility and moisture absorption resistance. An optical waveguide produced by employing the resin composition is also provided.

Abstract: An epoxy resin represented by general formula (2), wherein R1-R4 indicate a hydrocarbon group of carbon number 1-6, n is 0 or integer of 1 or more and X is a bond or the following general formula wherein R5-R6 indicate a hydrogen atom or hydrocarbon group of carbon number 1-6, obtained by reacting an aromatic compound represented by general formula (1) and epihalohydrine, wherein R1-R4 and X are as identified herein, having molecular weight distribution comprising, content of n=0 component in the epoxy resin represented by general formula (2) is 60% or less and epoxy equivalent is 250 g/eq or over.

Abstract: A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150° C.

Abstract: The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b).

Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.

Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, 1

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: The present invention is to provide a phosphorus containing epoxy resin compositions, comprising an epoxy resin composition (a) in which a phosphorus containing epoxy resin (A) and a hardener are contained, wherein said phosphorus containing epoxy resin (A) is a phosphorus containing resin composition prepared by reacting phosphorus containing organic compounds (B) obtained by the reaction in the range of molar ratio of 1.01 to 2 moles of organic phosphorus compounds (b) having one active hydrogen atom bonded to phosphorus atom and 1 mole of quinone compound with at least one kind of epoxy resins (C) selected from the groups composed of general formula 1, general formula 2 or general formula 3 so as the content of said epoxy resins (C) to be from 20 to 45 wt.

Abstract: An ink jet recording sheet having an excellent jet ink-fixing property and heat-sealing property and capable of recording thereon ink images having excellent water resistance and light fastness has an ink receiving layer formed on a surface of a support sheet and including a binder and fine particles of a water-insoluble, amino group-containing resin having a total amine value of 5 to 500 and preferably a glass transition temperature of 15 to 250° C.

Abstract: A halogenated flame retardant for a thermoplastic resin with carbonyl linkages in the main chain such as polyethylene terephthalate or polybutylene terephthalate is obtained by the modification of a brominated bisphenol A epoxy resin optionally advanced with brominated bisphenol A by reaction of the epoxy groups with a C1-C8 alcohol such as methanol or butanol to the extent that the ratio of unmodified epoxy groups to alcohol-modified epoxy groups is from 2/1 to 1/2.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: Modified epoxy resin compositions having excellent flexibility and excellent compatibility with conventional epoxy resins as well as exhibiting the original properties of the epoxy resin before being modified such as mechanical strength, adhesion, heat resistance are disclosed and chemical resistance, which are obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100. The modified adduct is obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] containing one primary amino group in the molecule and a compound [C] containing a hydroxy group in the molecule.

Abstract: The present invention relates to a room temperature curable epoxy resin adhesive composition having excellent T-peel strength, comprising an epoxy resin containing more than one epoxy group in a molecule on an average, and a hardener in the form of a polyamide-amine, which is obtained from reaction of polyamine with diene rubber having carboxyl terminal groups and other compound having carboxyl groups.

Abstract: Modified epoxy resin composition having excellent flexibility and excellent compatibility with conventional epoxy resins as well as the original properties of the epoxy resin before modified such as mechanical strength, adhesion, heat resistance and chemical resistance, which is obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100, said modified adduct being obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] of the formula: ##STR1## and a compound [C] of the formula:R.sub.3 --CH.sub.2).sub.m OH [II].