Abstract: The present invention is a short time curing method of epoxy resin compositions composed of epoxy resins with more than 1.8 epoxy groups and curing agents which can react with epoxy groups and cure the epoxy resins at ambient temperatures or under the temperature raising conditions radiating microwave in the range of 300 MHz to 30 GHz frequency.
Type:
Grant
Filed:
July 6, 2001
Date of Patent:
May 20, 2003
Assignees:
Nippon Liner Co., Ltd., Tohto Resin Products Co., Ltd.
Abstract: An epoxy resin composition which is cured transparent product having high neutron shielding capability, comprised by an epoxy resin without any not transparent inorganic substances and a hardener and characterized by said composition's viscosity at ambient temperatures is below 7000 mPa·s and said composition is curable at said temperatures.
Type:
Grant
Filed:
March 20, 2001
Date of Patent:
February 11, 2003
Assignees:
Sanoya Industry Co Ltd, Tohto Resin Products Co Ltd
Abstract: An epoxy resin composition which is cured transparent product having high neutron shielding capability, comprised by an epoxy resin without any not transparent inorganic substances and a hardener and characterized by said composition's viscosity at ambient temperatures is below 7000 mPa·s and said composition is curable at said temperatures.
Type:
Application
Filed:
March 20, 2001
Publication date:
December 20, 2001
Applicant:
SANOYA INDUSTRY CO., LTD. and TOHTO RESIN PRODUCTS CO., LTD