Abstract: The present invention provides a urethane foam molded product that has high thermal conductivity with minimal change to its physical properties. A simple method for producing the same is also provided. The urethane foam molded product includes a base material formed of a polyurethane foam, and a thermal conductive filler mixed in the base material and oriented to form mutual connections. The thermal conductive filler is formed of composite particles that include thermal conductive particles formed of a nonmagnetic material, and magnetic particles adhered to the surfaces of the thermal conductive particles.
Type:
Grant
Filed:
March 24, 2011
Date of Patent:
May 19, 2015
Assignees:
SUMITOMO RIKO COMPANY LIMITED, TOKAI CHEMICAL INDUSTRIAS, LTD.