Patents Assigned to TOKAI SHINEI ELECTRONICS INIDUSTRY CO., LTD
  • Patent number: 9857687
    Abstract: A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: January 2, 2018
    Assignees: TOKAI SHINEI ELECTRONICS INIDUSTRY CO., LTD, YAMATOYA & CO., LTD
    Inventors: Kazunori Tsuge, Yoshihito Tanaka, Koji Akiyama, Kiyoshi Tanaka, Kazuyoshi Nishio, Takehiro Kato, Masaru Murakami, Tadayoshi Saito, Hirotoshi Yoshimura, Akira Inoue, Iwao Numakura, Noriaki Tsukada