Abstract: An object of the present invention is to provide a Pd alloy, a Pd alloy material, and a probe pin for electric and electronic devices in which specific resistance, hardness, and processability are balanced at a higher level than before, and methods for manufacturing the same. In order to achieve this object, the Pd alloy for electric and electronic devices according to the present invention having a composition comprising 50.1 mass % or more and 55.5 mass % or less of Pd, 6.3 mass % or more and 16.1 mass % or less of Ag, 30.0 mass % or more and 38.0 mass % or less of Cu, and 0.5 mass % or more and 2.0 mass % or less of In is adopted.

Abstract: A precipitation-hardening alloy, including 17 to 23.6 at % of Ag, 0.5 to 1.1 at % of B, and a total of 74.9 to 81.5 at % of Pd and Cu, wherein the at % ratio of the Pd and Cu is 1:1 to 1:1.2, and the rest includes In and inevitable impurities. This provides an alloy with good overall balance, having all of maintaining low specific resistance, at least almost equal to that of conventional Ag—Pd—Cu alloys, and also having contact resistance stability (oxidation resistance), good plastic workability, and higher hardness than before.

Abstract: An object of the present invention is to provide a Pd alloy, a Pd alloy material, and a probe pin for electric and electronic devices in which specific resistance, hardness, and processability are balanced at a higher level than before, and methods for manufacturing the same. In order to achieve this object, the Pd alloy for electric and electronic devices according to the present invention having a composition comprising 50.1 mass % or more and 55.5 mass % or less of Pd, 6.3 mass % or more and 16.1 mass % or less of Ag, 30.0 mass % or more and 38.0 mass % or less of Cu, and 0.5 mass % or more and 2.0 mass % or less of In is adopted.

Abstract: [Problem to be solved] For an Ag—CuO alloy based electrode material for thermal fuses, rolling workability is significantly decreased as the content of CuO is increasing, and the reduction of a plate thickness is difficult in the rolling process after internal oxidation. [Solution] An electrode material for thermal fuses comprising 50 to 99 mass % of Ag and 1 to 50 mass % of Cu is provided, the material having a structure in which an internal oxidation layer is formed at each of the front and back surfaces, and having a non-oxidized layer in the central portion.

Abstract: The present invention provides an electrical/electronic material which has low contact resistance, excellent corrosion resistance, high hardness, high flexing strength and excellent processability. The electrical/electronic material is characterized by being composed of 20-40% by mass of Ag, 20-40% by mass of Pd, 10-30% by mass of Cu and 1.0-20% by mass of Pt and having a hardness of 340-420 HV at the time of precipitation hardening after metal forming and an adequate flexing strength.

Abstract: Although an Ag—CdO-based material has excellent electric properties such as deposition resistance, arc resistance and low contact resistance, which are required for an electric contact, the discharge standard provision in Japan, EC Directive on Waste from Electrical and Electronic Equipment (WEEE) and the like have been directed toward disuse of Cd, as already known. Thus, the present invention is characterized in that after an atmosphere in a pressured oxidation furnace is replaced with oxygen, the temperature of an internal-oxidative Ag alloy prepared under a condition of a cold roll rate of 50 to 95% is gradually raised from a temperature of 200° C. or less in a pressured oxygen atmosphere with an oxygen pressure of 5 to 50 kg/cm2 and internal oxidation processing is performed with an upper limit temperature of 700° C.

Abstract: An object is to provide a thermal fuse that is free of a trouble of welding contact between a movable electrode (4) and a lead (2) even when temperature of an equipment to which the thermal fuse is connected rises gradually and that has small electric resistance at the time of conduction.

Abstract: A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards and semiconductor device-housing packages assembled with the foregoing brazing material.

Abstract: An electric contact with a base metal used as a switch wherein the non-welded peripheral portion of the contact is prevented from bow-like bending and from peeling off. The electric contact with a base metal having a contact promoting shape is formed by die forging of a contact material joined to the base metal by resistance welding. The composite contact material is prepared by coating the core material of Ag-oxide contact material with non-oxide contact material. The side of the material in contact with the base metal is of non-oxide contact material. The contact material may be pressed to fill a groove preformed in the base metal, welded to protrusions preformed in the base metal, welded to the bottom of a cut preformed in the base metal, or welded to bottoms of recesses preformed in the base metal.

Abstract: This invention relates to a silver/metal oxide material for electrical contacts containing no Cd which essentially consists of Ag and 5 to 30% by weight of at least one of oxides of Sb, Sn, Zn, In, Cu, Mn, Bi and Pb, and further, if necessary, 0.05 to 2% by weight of at least one of oxides of Mg, Al, Fe, Ni, Co, Si, Ga, Ge, Te, Ca and Li, the total amount of said metal oxides being 5 to 32% by weight, wherein fine particles of said metal oxides are substantially uniformly distributed in a matrix whose main component is Ag in a sintered state, and wherein there are no grain boundaries formed by agglomerations or agglomerated layers of said metal oxides.