Patents Assigned to Tokuyama Sekisui Co., Ltd.
  • Publication number: 20200165433
    Abstract: The present invention provides a resin composition for molding that can provide a molded body having excellent heat resistance and excellent mechanical properties as well as high surface smoothness. The present invention also provides a molded body and a pipe each including the resin composition for molding. Provided is a resin composition for molding containing: a chlorinated polyvinyl chloride; a thermal stabilizer; and an impact resistance modifier, the chlorinated polyvinyl chloride having a chlorine content of 63 to 72% by mass, the thermal stabilizer containing a calcium-containing compound and a zinc-containing compound, the resin composition containing the thermal stabilizer in an amount of 0.4 to 10.0 parts by mass and the impact resistance modifier in an amount of 1.0 to 10.0 parts by mass relative to 100 parts by mass of the chlorinated polyvinyl chloride.
    Type: Application
    Filed: September 26, 2018
    Publication date: May 28, 2020
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hiroshi TANIGUCHI, Hiroaki MOCHIZUKI
  • Publication number: 20200157335
    Abstract: The present invention provides a resin composition for molding that can provide a molded body having excellent thermal stability, high impact resistance, and high surface smoothness. The present invention also provides a molded body including the resin composition for molding. Provided is a resin composition for molding including: a chlorinated polyvinyl chloride; an acrylic processing aid; and an impact resistance modifier, the acrylic processing aid containing an acrylic resin having a weight average molecular weight of 500,000 to 5,000,000, the resin composition containing the acrylic processing aid in an amount of 0.2 to 10 parts by mass and the impact resistance modifier in an amount of 0.5 to 8.0 parts by mass relative to 100 parts by mass of the chlorinated polyvinyl chloride.
    Type: Application
    Filed: September 26, 2018
    Publication date: May 21, 2020
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hiroshi TANIGUCHI, Tsukasa GOTOU
  • Patent number: 10000634
    Abstract: The present invention provides a resin composition for molding, including a chlorinated polyvinyl chloride and a thermal stabilizer, the chlorinated polyvinyl chloride having structural units (a) to (c) represented by formulae (a) to (c) shown below: —CCl2—??(a), —CHCl—??(b), —CH2—??(c), the proportion of the structural unit (a) being 17.5 mol % or less, the proportion of the structural unit (b) being 46.0 mol % or more, and the proportion of the structural unit (c) being 37.0 mol % or less, relative to the total number of moles of the structural units (a), (b), and (c), the chlorinated polyvinyl chloride having a chlorine content of 63 mass % or more and less than 72 mass %, the thermal stabilizer containing a calcium alkyl carboxylate and a zinc compound, and the resin composition for molding having a loss in quantity on heating at 230° C. of less than 2 mass %.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 19, 2018
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi Matsumura, Atsushi Seiki, Norikazu Mashino, Atsushi Kawano, Kei Yoshiyama
  • Patent number: 9765195
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: September 19, 2017
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi Matsumura, Atsushi Seiki, Ryota Yamasugi
  • Patent number: 9758633
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: September 12, 2017
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi Matsumura, Atsushi Seiki, Norikazu Mashino, Kei Yoshiyama, Atsushi Kawano
  • Publication number: 20170183491
    Abstract: The present invention provides a resin composition for molding that allows production of a molded body having excellent thermal stability as well as high flexibility and strength, without using heavy metals such as lead and tin, and also provides a molded body obtained using the resin composition for molding. The present invention provides a resin composition for molding, including a chlorinated polyvinyl chloride and a thermal stabilizer, the chlorinated polyvinyl chloride having structural units (a) to (c) represented by formulae (a) to (c) shown below: —CCl2—??(a), —CHCl—??(b), —CH2—??(c), the proportion of the structural unit (a) being 17.5 mol % or less, the proportion of the structural unit (b) being 46.0 mol % or more, and the proportion of the structural unit (c) being 37.
    Type: Application
    Filed: July 23, 2015
    Publication date: June 29, 2017
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi MATSUMURA, Atsushi SEIKI, Norikazu MASHINO, Atsushi KAWANO, Kei YOSHIYAMA
  • Patent number: 9611373
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: April 4, 2017
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi Matsumura, Atsushi Seiki, Norikazu Mashino, Kei Yoshiyama, Atsushi Kawano
  • Patent number: 9611374
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: April 4, 2017
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi Matsumura, Atsushi Seiki, Ryota Yamasugi
  • Publication number: 20170029594
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Application
    Filed: October 13, 2016
    Publication date: February 2, 2017
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi MATSUMURA, Atsushi SEIKI, Ryota YAMASUGI
  • Publication number: 20170029593
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) ?CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Application
    Filed: October 13, 2016
    Publication date: February 2, 2017
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi MATSUMURA, Atsushi SEIKI, Norikazu MASHINO, Kei YOSHIYAMA, Atsushi KAWANO
  • Publication number: 20170008981
    Abstract: The present invention provides a method for producing a chlorinated polyvinyl chloride which is excellent in thermal stability (initial discoloration resistance, heat-resistant stability) and is capable of providing a transparent article. The present invention relates to a method for producing a chlorinated polyvinyl chloride through thermal chlorination of a reaction solution including a vinyl chloride aqueous suspension that contains a vinyl chloride resin in a hermetically sealable reaction vessel, the method including: step 1 of initiating thermal chlorination by heating the reaction solution to 55° C. to 70° C. and then introducing chlorine into the reaction vessel; step 2 of raising the temperature of the reaction solution while maintaining the temperature inside the reaction vessel not higher than the glass transition temperature of a partially chlorinated polyvinyl chloride; and step 3 of carrying out the thermal chlorination at a predetermined temperature of 85° C. or higher but lower than 115° C.
    Type: Application
    Filed: March 31, 2015
    Publication date: January 12, 2017
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi MATSUMURA, Norikazu MASHINO
  • Patent number: 9493625
    Abstract: The present invention provides a thermally expandable microcapsule that has a high expansion ratio and durability at high temperatures, and is not likely to cause discoloration and odor when used for foam molding. The thermally expandable microcapsule of the present invention includes: a shell formed from a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell obtained by polymerizing a monomer composition that contains a nitrile monomer and a compound having a glycidyl group in a molecule, the shell exhibiting a value y of 50% or higher and a ratio y/x of 1.1 or higher, in which x represents a gel fraction at ordinary temperature, and y represents a gel fraction upon heating at 180° C. for 30 minutes.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: November 15, 2016
    Assignees: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hiroshi Yamauchi, Hiroyuki Morita, Satoshi Haneda, Yasuko Wada
  • Publication number: 20160208072
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Application
    Filed: September 26, 2014
    Publication date: July 21, 2016
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi MATSUMURA, Atsushi SEIKI, Ryota YAMASUGI
  • Publication number: 20160200893
    Abstract: The present invention aims to provide a chlorinated vinyl chloride-based resin composition with excellent thermal stability and a molded body thereof. The present invention relates to a resin composition for molding, including a chlorinated vinyl chloride-based resin, a thermal stabilizer, and a polyalcohol and/or a partial ester of a polyalcohol. The chlorinated vinyl chloride-based resin has a chlorine content of 65% by weight or more and less than 72% by weight. The chlorinated vinyl chloride-based resin has, based on the total number of moles of a structural unit (a) —CCl2—, a structural unit (b) —CHCl—, and a structural unit (c) —CH2—, a proportion of the structural unit (a) of 17.5 mol % or less, a proportion of the structural unit (b) of 46.0 mol % or more, and a proportion of the structural unit (c) of 37.0 mol % or less.
    Type: Application
    Filed: September 26, 2014
    Publication date: July 14, 2016
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Kenichi MATSUMURA, Atsushi SEIKI, Norikazu MASHINO, Kei YOSHIYAMA, Atsushi KAWANO
  • Publication number: 20150368423
    Abstract: The present invention provides a thermally expandable microcapsule that has a high expansion ratio and durability at high temperatures, and is not likely to cause discoloration and odor when used for foam molding. The thermally expandable microcapsule of the present invention includes: a shell formed from a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell obtained by polymerizing a monomer composition that contains a nitrile monomer and a compound having a glycidyl group in a molecule, the shell exhibiting a value y of 50% or higher and a ratio y/x of 1.1 or higher, in which x represents a gel fraction at ordinary temperature, and y represents a gel fraction upon heating at 180° C. for 30 minutes.
    Type: Application
    Filed: September 22, 2014
    Publication date: December 24, 2015
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hiroshi YAMAUCHI, Hiroyuki MORITA, Satoshi HANEDA, Yasuko WADA
  • Publication number: 20150005455
    Abstract: Chlorinated vinyl chloride resin may be produced through a heat chlorination reaction of an aqueous suspension of vinyl chloride resin in a hermetically sealable reaction vessel, the method including carrying out a first heat chlorination reaction while raising the temperature of an aqueous suspension of a vinyl chloride resin powder to a predetermined temperature within the range of 85° C. to 95° C., and subsequently carrying out a second heat chlorination reaction at the predetermined temperature.
    Type: Application
    Filed: November 30, 2012
    Publication date: January 1, 2015
    Applicant: TOKUYAMA SEKISUI CO., LTD.
    Inventor: Masatoshi Harada
  • Publication number: 20140345886
    Abstract: A thermally expandable multilayer packing for building material, having protruding parts and a body portion in the cross-sectional shape based a plane perpendicular to the longitudinal direction. The thermally expandable multilayer packing includes both a thermally expandable resin composition layer and a thermoplastic resin composition layer, wherein the thermally expandable resin composition forming the thermally expandable resin composition layer contains 100 parts by weight of a resin component containing a chlorinated polyvinyl chloride resin and/or an EPDM, 3 to 300 parts by weight of a thermally expandable graphite, 3 to 200 parts by weight of an inorganic filler and 20 to 200 parts by weight of a plasticizer. The thermally expandable resin composition layer and the thermoplastic resin composition layer are formed by simultaneous co-extrusion using the thermally expandable resin composition and the thermoplastic resin composition.
    Type: Application
    Filed: November 29, 2012
    Publication date: November 27, 2014
    Applicants: SEKISUI CHEMICAL CO., LTD., SEKISUI CHEMICAL HOKKAIDO CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Hideaki Yano, Kenji Otsuka, Masaki Tono, Katsuhiro Nakazato, Ryota Yamasugi, Kenichi Matsumura
  • Publication number: 20140336321
    Abstract: A chlorinated vinyl chloride resin composition for extrusion molding, characterized by: containing 100 parts by weight of a chlorinated vinyl chloride resin, 3 to 300 parts by weight of a thermally expandable graphite, 3 to 200 parts by weight of an inorganic filler and 20 to 200 parts by weight of a plasticizer; and containing no phosphorus compound (excluding phosphate plasticizer). A chlorinated vinyl chloride resin having a chlorine content of 60 to 72% by weight can be used as the resin component for extrusion molding.
    Type: Application
    Filed: November 29, 2012
    Publication date: November 13, 2014
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Ryota Yamasugi, Katsuhiro Nakazato, Hideaki Yano, Kenji Otsuka, Masaki Tono
  • Publication number: 20100063247
    Abstract: An object of the present invention is to provide a chlorinated vinyl chloride-based resin with few unstable structures and excellent thermal stability, and a molding article. The chlorinated vinyl chloride-based resin of the invention is an resin in which a chlorine content is 65 wt % or higher, and less than 69 wt %, —CCl2— is in an amount of 6.2 mol % or less, —CHCl— is in an amount of 58.0 mol % or higher, and —CH2— is in an amount of 35.8 mol % or less contained in a molecular structure.
    Type: Application
    Filed: November 24, 2006
    Publication date: March 11, 2010
    Applicants: SEKISUI CHEMICAL CO., LTD., TOKUYAMA SEKISUI CO., LTD.
    Inventors: Toshifumi Sanni, Hideaki Tanaka, Masatoshi Harada
  • Patent number: 7319114
    Abstract: Hollow polymer particles are provided to have an average particle diameter of 15 ?m or more and 500 ?m or less and a 10%-compressive strength of 1.5 MPa or more, and the hollow polymer particle includes a hollow portion in the interior. In addition, a porous ceramic filter is provided by firing a shaped material composed of a mixture in which the above-described hollow polymer particles are mixed to disperse in a ceramic composition.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: January 15, 2008
    Assignees: Sekisui Chemical Co., Ltd., Tokuyama Sekisui Co., Ltd.
    Inventors: Takahiro Ohmura, Yasushi Nakata, Yasuhiro Kawaguchi, Takahiro Yoshida