Abstract: Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

Abstract: Magazine for storing and supplying chip type circuit elements includes a tube having a bore formed therethrough in which the circuit elements are situated in stacked relationship for feeding toward an open supply end and wherein an elastic member is provided on the tube in the region of the supply end having a surface facing inwardly into the bore and wherein a keeper pawl extends inwardly from the free end of the elastic member into the bore at the supply end region, preferably slightly below the supply end, adapted to hold the leading circuit element under pressure prior to the same being supplied in one-by-one fashion and to prevent simultaneous supply of more than one circuit element from the supply end of the magazine and, additionally, to precisely locate each circuit element at the supply end. In one embodiment, longitudinally extending ribs protruding inwardly into the bore are formed on the bore defining surface of the tube which maintain the chip elements in precise mutual alignment.

Abstract: A method whereby chip type circuit elements are mounted at predetermined locations on a printed circuit board by a suction means and apparatus for performing the method are disclosed. The suction means picks up each circuit element from a respective stack supported in a vertical magazine and transfers and positions them above the predetermined locations on the printed circuit board which can have a predetermined pattern of laminar conductors on the upper surface thereof. The circuit elements are then released by termination of the applied suction and adhered to the board by a thermoplastic adhesive setting operation.

Abstract: A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electronic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device.

Abstract: In an apparatus and process for transport and support of electronic components, the leads of the components are mounted transversely and parallel to each other on a support strip adapted for being moved in a longitudinal direction. The leads are mounted so that they are parallel to each other and equidistant and held firmly in position by adhesive tape of specified thickness in relation to the thickness of the support strip. The leads protrude from at least one edge of the support strip to facilitate attachment of electronic components. Positive positioning of the leads at accurately spaced distances is achieved.

Abstract: A machine for processing and securing parallel lead electronic components into lead receiving openings formed in a printed circuit board having an improved insert assembly is provided. The machine includes a supply assembly for selectively supplying a parallel lead electronic component to be inserted. A transfer assembly including a plurality of chuck assemblies disposed around a rotary disc for supplying the selected electronic component and displacing the supplied electronic component to a release position. An insert assembly including a holding and guiding sub-assembly for receiving the selected electronic component from the chuck at the release position and a push bar sub-assembly adapted to engage the electronic component at the release position and displace the electronic component to an inserted position in the printed circuit board.

Abstract: A process and apparatus for the manufacture of a continuous web of parallel lead electronic components is provided. Wire for the leads of the components is straightened, cut into uniform predetermined lengths, formed into a U-shaped leadwire and fed onto a continuous moving support band. The parallel leads of the U-shaped lead wires are secured to the support band by adhesive tape at the same time the spacing between the parallel leads is controlled to insure dimensional accuracy. The parallel leads of the open end of the formed lead wires are formed with a cross-over portion and an electronic component element is connected to the formed end.

Abstract: An apparatus for storing and supplying parallel lead circuit elements that are secured to an elongated web is provided. The apparatus is adapted to supply the parallel lead circuit elements to a mechanism particularly adapted to process and secure the parallel lead electronic circuit elements to a printed circuit board. Storage and supply of the electronic circuit elements is affected by winding each of the webs carrying the parallel lead circuit elements about a reel, which reel is enclosed in a case. The apparatus is adapted to support each of the cases at predetermined positions and further dispose appropriate guiding and feeding structure proximate to each of the cases to effect guiding and feeding of each of the webs to the mechanism for processing and securing the parallel lead electronic circuit elements to a printed circuit board.

Abstract: An apparatus re-forms the axial lead of an axial-lead type electronic component into the shape of a U and affixes the electronic components with U-shaped leads to a support tape so as to form a continuous web-carrier carrying a series of electronic components each with a U-shaped lead. The apparatus feeds the electronic component one-by-one to a transfer assembly which transfers the components to a re-forming position and an affixing position in sequence. Means for forming a kink in a lead of each component and for removing excess lead wire are also provided.

Abstract: An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.

Abstract: A package for storing and feeding electronic components having parallel leads mounted equidistantly by the leads on tape is provided. The tape is wound in a spiral and packaged in the box prepared from a box blank. The box has a removable side face which is removed from the box for forming an opening through which the tape and the electronic components mounted thereon can be fed either manually or automatically without opening the package itself. The removable side face has an elongated retainer flap for serving to hold the tape and the electronic components mounted thereon firmly in position within the box.

Abstract: The electroconductive composite ceramics composed of an independent phase conglomerates having a particle diameter of at least 20.mu. and a continuous phase connecting mutually the independent phase of conglomerates. Particularly, electroconductive composite ceramics composed of (A) 50-98% by weight of an independent phase of conglomerates having a particle diameter of at least 20 which consists essentially of a phase of insulating or semiconductive ceramics having a high melting point or a mixture thereof and (B) 50-2% by weight of a continuous phase of an electroconductive substance connecting mutually the independent phase of conglomerates. The electroconductive composite ceramics exhibit stable electroconductivity-temperature characteristics at a temperature of 1000.degree. C. or higher and have excellent thermal shock resistance, mechanical strength and chemical resistance.

Abstract: Electronic components having parallel leads are mounted equidistantly by means of said leads on tape. The tape is wound in a spiral and packaged in a box prepared from a box blank. The box has a hinged opening in the side thereof through which the tape and the electronic components mounted thereon can be fed either manually or automatically without opening the package itself.

Abstract: Low thermally expansive, electroconductive composite sintered ceramics comprised of a phase of at least one ceramics selected from the group consisting of low thermally expansive ceramics and negatively thermally expansive ceramics, having dispersed thereinto substantially in a continuous state a phase of an electroconductive substance such as a metal.

Abstract: An apparatus for manufacturing from a cassette which initially has a continuous leader extending between and connected to a pair of rotary hubs thereof and from an elongated flexible information material carrying information which can be extracted from the material a cassette which has a length of the information material stored in the cassette with opposed ends of the information material connected with leaders which are respectively connected to the rotary hubs of the cassette.

Abstract: A machine for processing and securing parallel lead electronic circuit elements into lead receiving openings formed in a printed circuit board is provided. The machine includes a supply assembly for selectively supplying one group of a plurality of distinct groups of parallel lead electronic circuit elements, the supply assembly including a selecting sub-assembly for selecting one of the circuit elements from the selected group circuit elements to be supplied. A transfer assembly includes a chuck for receiving the supplied circuit elements and displacing same to a release position. An insert assembly is adapted to effect release of the circuit elements when the chuck is displaced to a release position and includes a holding sub-assembly for receiving each circuit element released by the chuck at the release position and a plunger sub-assembly adapted to engage the circuit elements at the release position and displace the circuit elements from the release position to an inserted position.

Abstract: An aggregation treatment apparatus for waste water which comprises a susping section for mixing particles of metal, metallic oxide or sintered metallic oxide into feed water such as sewage and drainage, and forming a slurry; an electrically aggregating section for the slurry which is installed separately from the suspending section; and a separating section which is formed integrally with the suspending section, and separating the particles from flocks in the treated water, returning the particles into the suspending section and discharging the treated water from the upper portion. The slurry is pumped from the suspending section to the electrically aggregating section. An electric field is applied to the slurry by means of an electrode tube in the electrically aggregating section, colloidal particles in the feed water is thereby aggregated to the added particles to form flocks and the treated water is then passed to the separating section.

Abstract: A catalyst for treating exhaust gas from engine vehicles which comprises a intered substance composed of ferric oxide and at least one metallic oxide and forming at least in part a spinel crystal structure. This catalyst can be strengthened by adding aluminum oxide as an additional ingredient. Also, by adding metallic ruthenium to the catalyst, its rate of converting nitrogen compounds can be increased and by adding metallic platinum to the catalyst, its rate of converting carbon monoxide and hydrocarbons can be increased.