Abstract: An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device.
Type:
Grant
Filed:
April 27, 1979
Date of Patent:
October 13, 1981
Assignee:
Tokyo Denki Kogaku Kogyo Kabushiki Kaisha